Jet soldering apparatus
US-2023390846-A1 · Dec 7, 2023 · US
Soldering by means of dipping in molten solder
Soldering by means of dipping in molten solder · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K1/08 |
| Official title | Soldering by means of dipping in molten solder |
| Display label | Soldering by means of dipping in molten solder |
| Total patents | 68 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 3 |
| 2016 | 6 |
| 2017 | 6 |
| 2018 | 9 |
| 2019 | 8 |
| 2020 | 9 |
| 2021 | 4 |
| 2022 | 10 |
| 2023 | 5 |
| 2024 | 3 |
| 2025 | 3 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Prevention of dripping of material for material injection
US-2023241700-A1 · Aug 3, 2023 · US
Soldering device and control method for soldering device
US-11697169-B2 · Jul 11, 2023 · US
Prevention of dripping of material for material injection
US-11684988-B2 · Jun 27, 2023 · US
Method for selectively pretinning a guidewire core
US-11548086-B2 · Jan 10, 2023 · US
Method and system for tin immersion and soldering of core wire
US-11517970-B2 · Dec 6, 2022 · US
Soldering system including temperature distribution measurement control device, control method, and program
US-11446751-B2 · Sep 20, 2022 · US
Detection device, detection method, and recording medium
US-2022283104-A1 · Sep 8, 2022 · US
Mold for forming solder distal tip for guidewire
US-2022226618-A1 · Jul 21, 2022 · US
Prevention of dripping of material for material injection
US-2022193805-A1 · Jun 23, 2022 · US
Aerosol provision device
US-2022142254-A1 · May 12, 2022 · US
Prevention of dripping of material for material injection
US-11298769-B2 · Apr 12, 2022 · US
Mold for forming solder distal tip for guidewire
US-11285299-B2 · Mar 29, 2022 · US
Soldering system and use
US-2022016724-A1 · Jan 20, 2022 · US
Using solder standoffs during reflow to reduce voiding with circuit boards
US-2022007518-A1 · Jan 6, 2022 · US
Wire automatic soldering system
US-11141807-B2 · Oct 12, 2021 · US
Soldering apparatus and soldering method
US-11059119-B2 · Jul 13, 2021 · US
Soldering method and soldering apparatus
US-11059117-B2 · Jul 13, 2021 · US
Mold for forming solder distal tip for guidewire
US-2021128884-A1 · May 6, 2021 · US
Soldering device and control method for soldering device
US-2020398359-A1 · Dec 24, 2020 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K1/08?
- CPC B23K1/08 is the Cooperative Patent Classification code for “Soldering by means of dipping in molten solder.”
- How many patents are filed under CPC B23K1/08 (Soldering by means of dipping in molten solder)?
- Our database includes 68 publications tagged with this CPC code.
- Is patent activity under CPC B23K1/08 growing?
- Publication counts under this code: 3 in 2024 vs 3 in 2025 (latest complete years).