Soldering system including temperature distribution measurement control device, control method, and program

Patent metadata

Field	Value
Publication number	US-11446751-B2
Application number	US-201816476431-A
Country	US
Kind code	B2
Filing date	Jan 26, 2018
Priority date	Jan 30, 2017
Publication date	Sep 20, 2022
Grant date	Sep 20, 2022

Abstract

A soldering system includes a temperature measurement device that measures a temperature distribution of a surface of a substrate. The soldering system also includes a driver that drives the soldering system based on a control parameter obtained from the temperature distribution measured by the temperature measurement device.

First claim

The invention claimed is:

1. A soldering system for jetting molten solder stored inside a solder bath to solder a solder workpiece, the soldering system comprising:
a temperature measurer to measure a temperature distribution of a surface of the solder workpiece;
a difference calculator to calculate the temperature distribution measured by the temperature measurer against a target temperature distribution and obtain a difference between the measured temperature distribution and the target temperature distribution;
an identifier to identify whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within a set allowable range;
a learning unit to obtain a control parameter when the identifier identifies the temperature distribution of the surface of the solder workpiece as being outside of the allowable range, the control parameter making the temperature distribution of the surface of the solder workpiece a temperature distribution that is within the allowable range; and
a driver to drive the soldering system based on the control parameter obtained by the learning unit,
wherein the identifier identifies, through machine learning based on the difference, whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within the allowable range.

2. The soldering system according to claim 1 , further comprising:
a feature amount extractor to extract a feature amount of the measured temperature distribution,
wherein the identifier identifies whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within the allowable range through machine learning based on (i) teacher data in which a feature amount of a temperature distribution of the surface of the solder workpiece that became soldering defective is assigned a label of defective and a feature amount of a temperature distribution of the surface of the solder workpiece that did not become soldering defective is assigned a label of normal and (ii) the feature amount of the measured temperature distribution.

3. The soldering system according to claim 1 , further comprising:
an evaluator to evaluate an existence or a non-existence of defective soldering in the solder workpiece that is soldered based on the control parameter; and
a teacher data creator to create teacher data in which the measured temperature distribution and the existence or the non-existence of defective soldering evaluated by the evaluator are in association with each other.

4. The soldering system according to claim 1 , wherein the learning unit uses a neural network to obtain the control parameter that makes the temperature distribution of the surface of the solder workpiece a temperature distribution that is within the allowable range.

5. The soldering system according to claim 4 , further comprising,
a learning data creator to create learning data in which a temperature distribution of the surface of the solder workpiece prior to a modifying of the control parameter, a modification amount of the control parameter, and a temperature distribution of the surface of the solder workpiece after the modifying of the control parameter are in association with one another,
wherein the learning unit obtains, based on the learning data, the control parameter that makes the temperature distribution of the surface of the solder workpiece a temperature distribution that is within the allowable range.

6. The soldering system according to claim 1 , wherein the temperature measurer captures an image of the surface of the solder workpiece by an infrared camera and measures the temperature distribution of the surface of the solder workpiece.

7. The soldering system according to claim 6 , wherein the infrared camera captures an image of the surface of the solder workpiece via an aluminum vapor deposited infrared reflective mirror.

8. The soldering system according to claim 1 , wherein the control parameter includes at least one of a temperature of the molten solder, a jet flow amount of the molten solder, a jet flow location of the molten solder, or a jet flow angle of the molten solder.

9. A control apparatus comprising:
a difference calculator to
calculate a temperature distribution of a surface of a solder workpiece against a target temperature distribution, the temperature distribution of the surface of the solder workpiece being acquired from a temperature measurer that measures the temperature distribution of the surface of the solder workpiece, and
obtain a difference between the acquired temperature distribution and the target temperature distribution;
an identifier to identify whether or not the acquired temperature distribution is a temperature distribution that is within a set allowable range;
a learning unit to obtain a control parameter of a soldering system when the identifier identifies the temperature distribution of the surface of the solder workpiece as being outside of the allowable range, the control parameter making the temperature distribution of the surface of the solder workpiece a temperature distribution that is within the allowable range; and
a driver to drive the soldering system based on the control parameter of the soldering system obtained by the learning unit,
wherein the identifier identifies, through machine learning based on the difference, whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within the allowable range.

10. A control method of a soldering system for jetting molten solder stored in a solder bath to solder a solder workpiece, the control method comprising:
measuring a temperature distribution of a surface of the solder workpiece;
calculating the measured temperature distribution of the surface of the solder workpiece against a target temperature distribution, and obtaining a difference between the measured temperature distribution and the target temperature distribution;
identifying whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within a set allowable range; and
obtaining a control parameter of the soldering system when the temperature distribution of the surface of the solder workpiece is identified as being outside of the allowable range, the control parameter making the temperature distribution of the surface of the solder workpiece a temperature distribution that is within the allowable range,
wherein the identifying includes identifying, through machine learning based on the difference, whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within the allowable range.

11. A non-transitory computer-readable recording medium storing a program, the program causing a computer to function as:
a temperature measurer to measure a temperature distribution of a surface of a solder workpiece;
a difference calculator to calculate the temperature distribution measured by the temperature measurer against a target temperature distribution, and obtain a difference between the measured temperature distribution and the target temperature distribution;
an identifier to identify whether or not the temperature distribution of the surface of the solder workpiece is a temperature distribution that is within a set allowable range; and
a learning unit to obtain a control parameter of a soldering system when the identifier identifies the temperature distribution of the surface of the solder workpiece as being outside of the allowable range, the control parameter mak

Assignees

• Mitsubishi Electric Corp

Inventors

• Kobayashi Takashi
• Tamura Masayoshi
• Kitagawa Nobuyasu
• Tanabe Tsuyoshi

Classifications

• H05K3/34

  by soldering · CPC title

• B23K3/0653

  with wave generating means, e.g. nozzles, jets, fountains · CPC title

• B23K3/08

  Auxiliary devices therefor · CPC title

• B23K1/00

  Soldering, e.g. brazing, or unsoldering (B23K3/00 takes precedence) · CPC title

• B23K1/002 Primary

  Soldering by means of induction heating · CPC title