Soldering method and soldering apparatus

Patent metadata

Field	Value
Publication number	US-11059117-B2
Application number	US-201916696907-A
Country	US
Kind code	B2
Filing date	Nov 26, 2019
Priority date	Feb 12, 2019
Publication date	Jul 13, 2021
Grant date	Jul 13, 2021

Abstract

To provide a soldering method and a soldering apparatus which are capable of preheating a mask without degrading throughput.Provided is a soldering method including preheating a mask on which a substrate is not placed, placing the substrate on the preheated mask, and bringing at least a part of the substrate placed on the preheated mask into contact with molten solder and thus soldering the substrate.

First claim

What is claimed is:

1. A soldering apparatus comprising:
a loading section configured to charge a substrate into the soldering apparatus,
an unloading section configured to unload the substrate out of the soldering apparatus, the unloading section being different from the loading section,
a mask preheater configured to preheat a mask on which the substrate is not placed,
a soldering section configured to solder the substrate placed on the mask which is preheated,
a preheating section including a substrate preheater configured to preheat the substrate which is not placed on the mask, and
a cooling section configured to cool the substrate soldered by the soldering section, and
a substrate discharging section configured to discharge and deliver the substrate soldered by the soldering section to the cooling section,
wherein the mask preheater is separate from the substrate preheater of the preheating section and the mask preheater is positioned separate from the preheating section and between the preheating section and the unloading section, and the cooling section is positioned separate from the soldering section and between the soldering section and the unloading section,
wherein the loading section and the unloading section are disposed at the same end,
the cooling section extends from the substrate discharging section to the unloading section, and
the substrate is delivered in a first direction from the loading section to the substrate discharging section, and delivered in a second direction opposite to the first direction through the cooling section to the unload section.

2. The soldering apparatus according to claim 1 ,
wherein the soldering section includes a solder tank containing molten solder and a transferring mechanism configured to transfer the mask on which the substrate is placed at least in a vertical direction to solder the substrate; and
wherein the mask preheater is in the soldering section and includes the transferring mechanism being further configured to bring the mask on which the substrate is not placed into contact with the molten solder in the solder tank to preheat the mask.

3. The soldering apparatus according to claim 2 ,
wherein the transferring mechanism is configured to immerse the entire mask on which the substrate is not placed in the molten solder.

4. The soldering apparatus according to claim 1 ,
wherein the mask preheater includes a torch heater configured to blow a hot wind against the mask on which the substrate is not placed.

5. The soldering apparatus according to claim 1 , comprising:
a temperature sensor configured to detect temperature of the mask; and
a controller configured to control the mask preheater,
wherein, when the controller determines that the temperature of the mask reaches a predetermined or lower value, the controller controls the mask preheater to preheat the mask on which the substrate is not placed.

6. The soldering apparatus according to claim 1 , comprising:
a substrate sensor configured to detect that the substrate is charged into the soldering apparatus, and
a controller configured to control the mask preheater,
wherein the controller controls the mask preheater to preheat the mask on which the substrate is not placed when the charging of the substrate in the soldering apparatus is not detected by the substrate sensor for a predetermined time period.

7. A soldering apparatus comprising:
a loading section configured to charge a substrate into the soldering apparatus,
an unloading section configured to unload the substrate out of the soldering apparatus, the unloading section being different from the loading section,
a mask preheater configured to preheat a mask on which the substrate is not placed,
a soldering section configured to solder the substrate placed on the mask which is preheated,
a preheating section including a substrate preheater configured to preheat the substrate which is not placed on the mask, and
a cooling section configured to cool the substrate soldered by the soldering section,
wherein the mask preheater is separate from the substrate preheater of the preheating section and the mask preheater is positioned separate from the preheating section and between the preheating section and the unloading section, and the cooling section is positioned separate from the soldering section and between the soldering section and the unloading section, and
wherein the mask preheater includes a torch heater configured to blow a hot wind against the mask on which the substrate is not placed.

Assignees

• Senju Metal Industry Co
• Senju System Tech Co Ltd

Inventors

• Hashimoto Noboru
• Kasama Takahiro

Classifications

• B23K3/0669

  with dipping means · CPC title

• B23K3/08

  Auxiliary devices therefor · CPC title

• H05K3/34 Primary

  by soldering · CPC title

• B23K1/08 Primary

  Soldering by means of dipping in molten solder · CPC title

• H05K2203/111

  Preheating, e.g. before soldering · CPC title