Method and system for tin immersion and soldering of core wire

US11517970B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11517970-B2
Application numberUS-201716756825-A
CountryUS
Kind codeB2
Filing dateDec 14, 2017
Priority dateOct 30, 2017
Publication dateDec 6, 2022
Grant dateDec 6, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Disclosed are a method and a system for tin immersion and soldering of a core wire which includes: inserting a core wire row into molten tin vertically; moving the each core wire in the molten tin along a direction perpendicular to the core wire row to remove carbonized matter from each core wire on a moving direction side; pulling the each core wire out of the molten tin; and performing alignment, such that the inner core conductor of the each core wire on the moving direction side contacts with a bonding pad. According to the technical solution of the present disclosure, the carbonized matter on the core wire that aligned facing the bonding pad is removed, such that the temperature transfer effect of the automatic soldering is improved, the yield of the automatic soldering is improved, and the consistency and the yield of the automatic soldering are more stable.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for tin immersion and soldering of core wire, characterized in, comprising: inserting a core wire row into molten tin vertically to melt an insulation skin on each core wire of the core wire row and complete pre-tinning of an inner core conductor; moving the each core wire in the molten tin along a direction perpendicular to the core wire row to remove carbonized matter from the each core wire on a moving direction side, wherein the carbonized matter is generated from the melted skin during the melting of the insulation skin; pulling the each core wire out of the molten tin; and performing alignment, such that the inner core conductor of the each core wire on the moving direction side is respectively in contact with a bonding pad. 2. The method according to claim 1 , wherein the inserting a core wire row into molten tin vertically comprises: making ends for soldering of a plurality of core wires in a straight and ordered arrangement to obtain the core wire row; and inserting the core wire row into the molten tin vertically for 1 to 3 seconds. 3. The method according to claim 2 , wherein a temperature of the molten tin is 380° C. to 420° C. 4. The method according to claim 1 , wherein the moving the each core wire in the molten tin along a direction perpendicular to the core wire row comprises: moving the each core wire for 1 to 2 seconds. 5. The method according to claim 4 , wherein the moving the each core wire in the molten tin along a direction perpendicular to the core wire row comprises: moving the each core wire for 20 to 40 mm. 6. The method of claim 1 , wherein the pulling the each core wire out of the molten tin comprises: pulling the each core wire out of the molten tin within 0.1 to 0.3 seconds. 7. The method according to claim 1 , further comprising: soldering the each core wire to the bonding pad after the alignment is performed. 8. The method according to claim 2 , further comprising: soldering the each core wire to the bonding pad after the alignment is performed. 9. The method according to claim 3 , further comprising: soldering the each core wire to the bonding pad after the alignment is performed. 10. The method according to claim 4 , further comprising: soldering the each core wire to the bonding pad after the alignment is performed. 11. The method according to claim 5 , further comprising: soldering the each core wire to the bonding pad after the alignment is performed. 12. The method according to claim 6 , further comprising: soldering the each core wire to the bonding pad after the alignment is performed.

Assignees

Inventors

Classifications

  • Wires · CPC title

  • Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title

  • B23K1/08Primary

    Soldering by means of dipping in molten solder · CPC title

  • B23K1/0006Primary

    Exothermic brazing · CPC title

  • B23K1/206Primary

    Cleaning · CPC title

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What does patent US11517970B2 cover?
Disclosed are a method and a system for tin immersion and soldering of a core wire which includes: inserting a core wire row into molten tin vertically; moving the each core wire in the molten tin along a direction perpendicular to the core wire row to remove carbonized matter from each core wire on a moving direction side; pulling the each core wire out of the molten tin; and performing alignm…
Who is the assignee on this patent?
Goertek Inc
What technology area does this patent fall under?
Primary CPC classification B23K1/08. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 06 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).