Soldering apparatus and soldering method

Patent metadata

Field	Value
Publication number	US-11059119-B2
Application number	US-202016740299-A
Country	US
Kind code	B2
Filing date	Jan 10, 2020
Priority date	Apr 22, 2019
Publication date	Jul 13, 2021
Grant date	Jul 13, 2021

Abstract

A soldering apparatus 100 including: a chamber 120 configured to contain solder and include an opening 122 configured to discharge the solder in a bottom surface or a side surface; a pump 140 configured to transport the solder to the chamber 120 ; and an inner bath 160 configured to communicate with the opening 120 and perform soldering using the solder fed through the opening 120.

First claim

What is claimed is:

1. A soldering apparatus comprising:
a chamber configured to contain solder and including an opening that is configured to discharge the solder and that is present in a bottom surface of the chamber;
a pump configured to transport the solder to the chamber; and
an inner bath configured to communicate with the opening and perform soldering using the solder fed through the opening,
wherein
the inner bath contains the solder and includes a discharge hole configured to discharge the contained solder in a bottom surface of the inner bath.

2. The soldering apparatus according to claim 1 , wherein
the pump includes a cylinder with a hole and a screw arranged in the hole;
the pump transports the solder from a lower position to a higher position relative to gravity by a rotation of the screw.

3. The soldering apparatus according to claim 1 , wherein the pump comprises a screw pump.

4. The soldering apparatus according to claim 1 , wherein
the chamber includes a ventilation port configured to communicate with atmosphere.

5. A soldering apparatus comprising:
a chamber configure to contain solder and including an opening configured to discharge the solder in a bottom surface or a side surface of the chamber;
a pump configured to transport the solder to the chamber; and
an inner bath configured to communicate with the opening and perform soldering using the solder fed through the opening;
an outer bath;
a base plate configured to divide an interior of the outer bath into an outer bath upper portion configured to receive the solder discharged through the discharge hole and an outer bath lower portion, the base plate including:
a solder intake port configured to link the outer bath upper portion and the outer bath lower portion,
an inner bath coupling port configured to communicate with the inner bath,
a chamber coupling port configured to communicate with the chamber, and
an opening coupling port configured to communicate with the opening; and

a shield plate configured to divide the outer bath lower portion into a first lower portion configured to include a flow passage from the solder intake port to the chamber coupling port and a second lower portion configured to include a flow passage from the opening coupling port to the inner bath coupling port,
wherein the inner bath contains the solder and includes a discharge hole configured to discharge the contained solder in a bottom surface of the inner bath, and wherein the pump transports the solder from the first lower portion to the chamber.

6. A soldering method comprising:
discharging solder through an opening that is present in a bottom surface of a chamber that is configured to contain the solder;
transporting the solder to the chamber by a pump;
performing soldering using the solder fed through the opening to an inner bath configured to communicate with the opening; and
discharging the contained solder through a discharge hole positioned in a bottom surface of the inner bath.

Assignees

• Senju Metal Industry Co

Inventors

• Hashimoto Noboru
• Kasama Takahiro

Classifications

• B23K3/0669

  with dipping means · CPC title

• B23K2101/42

  Printed circuits · CPC title

• B23K3/00 Primary

  Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods · CPC title

• H05K3/34

  by soldering · CPC title

• B23K1/08

  Soldering by means of dipping in molten solder · CPC title