Forced-feed pressure control device and forced-feed pressure control method
US-2018229322-A1 · Aug 16, 2018 · US
Soldering device and control method for soldering device
US11697169B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11697169-B2 |
| Application number | US-202016904918-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 18, 2020 |
| Priority date | Jun 19, 2019 |
| Publication date | Jul 11, 2023 |
| Grant date | Jul 11, 2023 |
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- Title
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Abstract
Official abstract text for this publication.
A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.
First claim
Opening claim text (preview).
What is claimed is: 1. A soldering device, comprising: a jet nozzle that jets a molten solder; a cover that is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle; and a pressing part that presses the cover, wherein: the cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside of the cover for a waiting time period other than the application time period; for the application time period, (i) the cover contacts a conveyance body that houses the application target in an inside thereof and (ii) the inside of the conveyance body and the inside of the cover are joined so that the inert gas that fills the inside of the cover flows into the inside of the conveyance body and thereby the application target that is housed in the inside of the conveyance body is surrounded by the inert gas that fills the inside of the conveyance body; and during a time in the application time period in which the cover is moved by pressure of the conveyance body, the pressing part presses the cover against the conveyance body. 2. The soldering device according to claim 1 , wherein the pressing part is an air cylinder. 3. A soldering device, comprising: a jet nozzle that jets a molten solder; a cover that is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle; and a pressing part that presses the cover, wherein: the cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside of the cover for a waiting time period other than the application time period; for the application time period, (i) the cover contacts a conveyance body that houses the application target in an inside thereof and (ii) the inside of the conveyance body and the inside of the cover are joined so that the application target that is housed in the inside of the conveyance body is surrounded by the inert gas that fills the inside of the conveyance body; the inside of the cover is put into a positive pressure state by the inert gas for the waiting time period so as to provide an opening state without providing an opening and closing mechanism for the hole part; and during a time in the application time period in which the cover is moved by pressure of the conveyance body, the pressing part presses the cover against the conveyance body. 4. The soldering device according to claim 3 , wherein the pressing part is an air cylinder.
Assignees
Inventors
Classifications
- B23K3/0653Primary
with wave generating means, e.g. nozzles, jets, fountains · CPC title
electric · CPC title
Auxiliary devices therefor · CPC title
- B23K1/08Primary
Soldering by means of dipping in molten solder · CPC title
Printed circuits · CPC title
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Frequently asked questions
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- What does patent US11697169B2 cover?
- A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and …
- Who is the assignee on this patent?
- Denso Ten Ltd, Senju System Tech Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification B23K3/0653. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jul 11 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).