Prevention of dripping of material for material injection

US11298769B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11298769-B2
Application numberUS-201916410651-A
CountryUS
Kind codeB2
Filing dateMay 13, 2019
Priority dateMay 13, 2019
Publication dateApr 12, 2022
Grant dateApr 12, 2022

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the opening part, in which the member allows gas to flow into and flow out from the opening part.

First claim

Opening claim text (preview).

What is claimed is: 1. An injection apparatus for injecting material, comprising: a first tank for storing a material, the first tank including a first valve; a second tank in fluid communication with the first tank via a single flow channel, the second tank including a second valve; and a head body having a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the first tank; wherein the second valve enables gas to flow into and flow out from the opening part and wherein the head body is horizontally aligned with the single flow channel. 2. The injection apparatus of claim 1 , wherein the opening part has a form of a slit. 3. The injection apparatus of claim 1 , wherein the head body is disposed directly under both the first and second tanks. 4. The injection apparatus of claim 1 , wherein the single flow channel of the head body includes a first connection channel connected to the first tank and a second connection channel connected to the second tank. 5. The injection apparatus of claim 2 , wherein the first valve of the first tank is opened or closed and connected to ambient environment, a positive pressure line or a vacuum line depending on an operation status. 6. The injection apparatus of claim 2 , wherein the injection apparatus is scanned on the substrate with the opening part covered by the substrate and filled with the material. 7. The injection apparatus of claim 2 , wherein the injection apparatus is lifted up from the substrate in response to transfer of the material from the opening part to the first tank. 8. The injection apparatus of claim 4 , wherein the opening part has a first end connected to the first connection channel and a second end connected to the second connection channel. 9. A material injection system for injecting material, comprising a stage for receiving a substrate; an injection apparatus comprising: a first tank for storing a material, the first tank including a first valve; a second tank in fluid communication with the first tank via a single flow channel, the second tank including a second valve; a head body having a surface for contacting the substrate on the stage and an opening part opened at the surface for discharging the material in fluid-communication with the first tank; wherein the second valve enables gas to flow into and flow out from the opening part and wherein the head body is horizontally aligned with the single flow channel; a position controller to control a relative position of the injection apparatus with respect the substrate on the stage; and a flow controller to control a flow of the material. 10. The material injection system of claim 9 , wherein the opening part has a form of a slit. 11. The material injection system of claim 10 , wherein the position controller places the injection apparatus onto the substrate and the flow controller discharges the material from the opening part of the injection apparatus and transfers the material filled in the opening part to the tank of the injection apparatus while taking the gas into the opening part through the at least one member. 12. The material injection system of claim 10 , wherein the position controller lifts up the injection apparatus from the substrate in response to the first tank being sealed or vacuumed, to move the injection apparatus out of the substrate in response to the injection apparatus being lifted and to move the injection apparatus onto a new substrate in response to the new substrate being placed on the stage. 13. The material injection system of claim 10 , wherein the material injection system further comprises: a positive pressure line connected to the first tank of the injection apparatus, the positive pressure line providing pressure to push the material stored in the first tank to the opening part during scanning of the injection apparatus. 14. The material injection system of claim 10 , wherein the material is molten solder, the material injection system is an injection molded soldering (IMS) system and the molten solder is filled in a hole or cavity formed at a surface of the substrate.

Assignees

Inventors

Classifications

  • B23K3/0638Primary

    for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · CPC title

  • Auxiliary devices therefor · CPC title

  • Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating · CPC title

  • Soldering by means of dipping in molten solder · CPC title

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What does patent US11298769B2 cover?
An injection apparatus for injection material is disclosed. The injection apparatus includes a tank for storing material. The injection apparatus further includes a head body that has a surface for contacting a substrate and an opening part opened at the surface for discharging the material in fluid-communication with the tank. The injection apparatus further includes a member connected to the …
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification B23K3/0638. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Apr 12 2022 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).