Fabricating a conductive trace structure and substrate having the structure

Patent metadata

Field	Value
Publication number	US-9826634-B2
Application number	US-201214345352-A
Country	US
Kind code	B2
Filing date	Nov 27, 2012
Priority date	Nov 28, 2011
Publication date	Nov 21, 2017
Grant date	Nov 21, 2017

Abstract

A method for fabricating a conductive trace structure includes the steps: forming a first metal layer on a non-conductive substrate; removing a part of the first metal layer to expose the non-conductive substrate so as to form the first metal layer into a plating region and a non-plating region, the plating region being divided into at least two trace-forming portions and at least one bridge portion; forming a second metal layer on the plating region by electroplating the plating region using one of the trace-forming portions and the bridge portion as an electrode; and removing the bridge portion and the second metal layer formed on the bridge portion.

First claim

What is claimed is:

1. A substrate having a conductive trace structure, consisting essentially of:
a patterned substrate having a patterned region that is formed on a surface of said patterned substrate and that includes at least two first pattern areas and at least one second pattern area interconnecting said first pattern areas, each of said first pattern areas having a porous microstructure; and
a conductive trace structure only formed on said first pattern areas, and including an activator film that has active metal.

2. The substrate of claim 1 , wherein said porous microstructure of each of said first pattern areas is formed by laser ablating said surface of said patterned substrate.

3. The substrate of claim 1 , wherein said patterned substrate is made of a non-conductive material.

4. The substrate of claim 3 , wherein said non-conductive material consists of a polymer.

5. The substrate claim 1 , wherein said porous microstructure has a pore size ranging from 1 μm to 20 μm.

6. The substrate of claim 1 , wherein said second pattern area is formed by laser ablation.

7. The substrate of claim 1 , wherein said conductive trace structure has a planar and smooth surface.

8. The substrate of claim 1 , wherein said active metal is selected from the group consisting of palladium, rhodium, osmium, iridium, platinum, gold, nickel, iron, and combinations thereof.

9. A method for fabricating a conductive trace structure, comprising the steps:
forming a first metal layer on a non-conductive substrate;
removing a part of the first metal layer to expose the non-conductive substrate so as to form the first metal layer into a plating region and a non-plating region separated from the plating region by the exposed non-conductive substrate, the plating region being divided into at least two trace-forming portions and at least one bridge portion interconnecting the trace-forming portions;
forming a second metal layer on the plating region by electroplating the plating region using one of the trace-forming portions and the bridge portion as an electrode; and
removing the bridge portion of the first metal layer and the second metal layer formed on the bridge portion,
wherein the non-conductive substrate is patterned to form a patterned region on a surface of the non-conductive substrate prior to forming the first metal layer on the non-conductive substrate, the patterned region corresponding in position to the plating region of the first metal layer and having a porous microstructure.

10. The method of claim 1 , wherein the step of removing a part is conducted by laser ablation.

11. The method of claim 1 , wherein the step of forming a first metal layer involves dipping the non-conductive substrate into an activator solution containing active metal ions such that the active metal ions are adsorbed on the non-conductive substrate to form an activator film, and forming a metal film on the activator film by electroless plating, the activator film and the metal film cooperatively forming the first metal layer.

12. The method of claim 11 , wherein the active metal ions are selected from the group consisting of palladium, rhodium, osmium, iridium, platinum, gold, nickel, iron, and combinations thereof.

13. The method of claim 1 , wherein the step of removing a part and the step of patterning are conducted by laser ablation at conductions of a laser power ranging from 4 W to 30 W, a frequency ranging from 5 KHz to 30 KHz, and a laser power density ranging from 1% to 7% of the output power.

14. The method of claim 1 , wherein the step of removing the bridge is conducted by laser ablation, chemical removing method, or a physically processing method.

15. The method of claim 1 , wherein, in the step of forming a second metal layer portion is used as the electrode.

16. A method for fabricating a conductive trace structure including the steps of:
forming a first metal layer on a non-conductive substrate;
removing a part of the first metal layer to expose the non-conductive substrate so as to form the first metal layer into a plating region and a non-plating region, the plating region being divided into at last two trace-forming portions and at least one bridge portion;
forming a second metal layer on the plating region by electroplating the plating region using one of the trace-forming portions and the bridge portion as an electrode; and
removing the bridge portion and the second metal layer formed on the bridge portion,
wherein the non-conductive substrate is patterned to form a patterned region on a surface of the non-conductive substrate prior to forming the first metal layer on the non-conductive substrate, the patterned region corresponding in position to the plating region of the first metal layer and having a porous microstructure.

Assignees

• Taiwan Green Point Entpr Co
• Taiwan Green Point Entpr Co

Inventors

• Yi Sheng-Hung
• Liao Pen-Yi
• Chen Min-Hsiang

Classifications

• H05K2203/108

  Using a plurality of lasers or laser light with a plurality of wavelengths · CPC title

• H05K3/242 Primary

  characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated · CPC title

• H05K3/188

  by direct electroplating · CPC title

• H05K3/182

  characterised by the patterning method · CPC title

• H05K2203/107

  Using laser light · CPC title