Led device
US-2017343204-A1 · Nov 30, 2017 · US
characterised by the patterning method
characterised by the patterning method · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H05K3/182 |
| Official title | {characterised by the patterning method} |
| Display label | characterised by the patterning method |
| Total patents | 191 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 21 |
| 2016 | 30 |
| 2017 | 25 |
| 2018 | 21 |
| 2019 | 25 |
| 2020 | 18 |
| 2021 | 20 |
| 2022 | 8 |
| 2023 | 8 |
| 2024 | 10 |
| 2025 | 4 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Metalized plastic articles and methods thereof
US-9770887-B2 · Sep 26, 2017 · US
Photosensitive resin composition, photosensitive element, cured product, semiconductor device, method for forming resist pattern, and method for producing circuit substrate
US-2017261852-A1 · Sep 14, 2017 · US
Composition for forming conductive pattern and resin structure having conductive pattern
US-2017236614-A1 · Aug 17, 2017 · US
Method for manufacturing multilayer circuit board, and multilayer circuit board
US-2017188459-A1 · Jun 29, 2017 · US
Polymer composition, ink composition and method for selectively metallizing insulating substrate
US-2017175271-A1 · Jun 22, 2017 · US
Method for manufacturing laminate containing patterned layers to be plated, method for manufacturing metal layer-containing laminate, touch panel sensor, touch panel, laminate containing patterned layers to be plated, and metal layer-containing laminate
US-2017160837-A1 · Jun 8, 2017 · US
Process of depositing a metallic pattern on a medium
US-9674966-B2 · Jun 6, 2017 · US
Method for forming high-definition metal pattern, high-definition metal pattern, and electronic component
US-9629253-B2 · Apr 18, 2017 · US
Microelectronic build-up layers and methods of forming the same
US-2016374210-A1 · Dec 22, 2016 · US
Ink formulations for flexographic printing of high-resolution conducting patterns
US-9511582-B2 · Dec 6, 2016 · US
Methods for providing electrically-conductive articles
US-9516760-B2 · Dec 6, 2016 · US
Galvanic process for making printed conductive metal markings for chipless rfid applications
US-2016353579-A1 · Dec 1, 2016 · US
Plasma treatments for flexures of hard disk drives
US-2016329067-A1 · Nov 10, 2016 · US
Catalyst for a catalytic ink and uses thereof
US-2016289469-A1 · Oct 6, 2016 · US
Method for activating a copper surface for electroless plating
US-9441299-B2 · Sep 13, 2016 · US
Method for forming patterned conductive film
US-9435032-B2 · Sep 6, 2016 · US
Galvanic process for making printed conductive metal markings for chipless RFID applications
US-9439293-B2 · Sep 6, 2016 · US
Light source unit
US-2016219708-A1 · Jul 28, 2016 · US
Self-aligned capillarity-assisted microfabrication
US-9401306-B2 · Jul 26, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H05K3/182?
- CPC H05K3/182 is the Cooperative Patent Classification code for “characterised by the patterning method.”
- How many patents are filed under CPC H05K3/182 (characterised by the patterning method)?
- Our database includes 191 publications tagged with this CPC code.
- Is patent activity under CPC H05K3/182 growing?
- Publication counts under this code: 10 in 2024 vs 4 in 2025 (latest complete years).