Metal-film forming apparatus and metal-film forming method

Patent metadata

Field	Value
Publication number	US-10077505-B2
Application number	US-201514979914-A
Country	US
Kind code	B2
Filing date	Dec 28, 2015
Priority date	Dec 26, 2014
Publication date	Sep 18, 2018
Grant date	Sep 18, 2018

Abstract

A metal-film forming apparatus includes: an anode; a resin substrate having a surface on which a conductor pattern layer that serves as a cathode is formed; a solid electrolyte membrane that contains metal ions and is between the anode and the resin substrate, the solid electrolyte membrane contacting a surface of the conductor pattern layer when a metal film is formed; a power supply; and a conductive member that is arranged contacting the conductor pattern layer when the metal film is formed, such that a negative electrode of the power supply is electrically connected to the conductor pattern layer, the conductive member being detachable from the conductor pattern layer, wherein the metal ions are reduced to deposit metal that forms the metal film on the surface of the conductor pattern layer when the voltage is applied.

First claim

What is claimed is:

1. A metal-film forming apparatus comprising:
an anode;
a resin substrate having a surface on which a conductor pattern layer that serves as a cathode is formed;
a solid electrolyte membrane that contains metal ions and is arranged between the anode and the resin substrate, the solid electrolyte membrane being arranged contacting a surface of the conductor pattern layer when a metal film is formed on the conductor pattern layer;
a power supply that applies a voltage between the anode and the conductor pattern layer; and
a conductive member that is arranged contacting at least an end portion of the conductor pattern layer when the metal film is formed on the conductor pattern layer, such that a negative electrode of the power supply is electrically connected to the conductor pattern layer, the conductive member being detachable from the conductor pattern layer, wherein
the metal ions are reduced to deposit metal that forms the metal film on the surface of the conductor pattern layer when the voltage is applied between the anode and the conductor pattern layer, wherein
the conductive member is a metal plate that covers the resin substrate,
the conductive member has a through-hole corresponding to a pattern shape of the conductor pattern layer, and
the conductive member is arranged such that an opening edge that forms the through-hole of the conductive member contacts the end portion of to the conductor pattern layer when the metal film is formed without covering a film-forming region of the surface of the conductor pattern layer; and
wherein the resin substrate is disposed on a metal base, the conductive member includes flange portions formed on outer edges of the conductive member, the flange portions contacting the metal base such that the negative electrode of the power supply is electrically connected to the conductor pattern layer via the metal base and the conductive member.

2. The metal-film forming apparatus according to claim 1 , wherein
the conductive member is attached to the solid electrolyte membrane.

3. The metal-film forming apparatus according to claim 1 , wherein
the metal film is made of copper, nickel, silver, or gold, and
the conductive member is made of aluminum, titanium, molybdenum, tungsten, or an alloy of at least two of aluminum, titanium, molybdenum, and tungsten.

4. A metal-film forming method, comprising:
executing a forming of a metal film on a surface of a conductor pattern layer provided on a surface of a resin substrate by depositing metal on the surface of the conductor pattern layer, by applying a voltage between an anode and the conductor pattern layer that serves as a cathode and reducing metal ions in a solid electrolyte membrane, in a state where the solid electrolyte membrane is arranged between the anode and the resin substrate to contact the surface of the conductor pattern layer, wherein
the forming of the metal film includes applying the voltage between the anode and the conductor pattern layer in a state where a conductive member that is detachable from the conductor pattern layer contacts at least an end portion of the conductor pattern layer, such that a negative electrode of a power supply that applies the voltage is electrically connected to the conductor pattern layer, wherein
the conductive member is a metal plate that covers the resin substrate,
the conductive member has a through-hole corresponding to a pattern shape of the conductor pattern layer, and
the metal film is formed while the conductive member is arranged such that an opening edge that forms the through-hole of the conductive member contacts the end portion of the conductor pattern layer when the metal film is formed without covering a film-forming region of the surface of the conductor pattern layer, so that the conductive member is electrically connected to the conductor pattern layer, and
wherein the resin substrate is disposed on a metal base, the conductive member includes flange portions formed on outer edges of the conductive member, the flange portions contacting the metal base such that the negative electrode of the power supply is electrically connected to the conductor pattern layer via the metal base and the conductive member.

5. The metal-film forming method according to claim 4 , wherein
the forming of the metal film is performed in a state where the conductive member is attached to the solid electrolyte membrane.

6. The metal-film forming method according to claim 4 , wherein
the metal film is made of copper, nickel, silver, or gold,
and the conductive member is made of aluminum, titanium, molybdenum, tungsten, or an alloy of at least two of aluminum, titanium, molybdenum, and tungsten.

Assignees

• Toyota Motor Co Ltd

Inventors

• Hiraoka Motoki
• Yanagimoto Hiroshi
• Sato Yuki

Classifications

• C25D17/14

  for pad-plating · CPC title

• C25D17/005

  Contacting devices · CPC title

• C25D3/48

  of gold · CPC title

• C25D3/12

  of nickel or cobalt · CPC title

• C25D3/38

  of copper · CPC title