Method for manufacturing planar coil

Patent metadata

Field	Value
Publication number	US-2018174748-A1
Application number	US-201715840243-A
Country	US
Kind code	A1
Filing date	Dec 13, 2017
Priority date	Dec 15, 2016
Publication date	Jun 21, 2018
Grant date	—

Abstract

Disclosed herein is a method for manufacturing a planar coil, the method including forming a base conductive layer on a base material, the base conductive layer including: a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position; a power-feed wiring portion that connects the first connecting position with an external power source; and a connection wiring portion that short-circuits the second connecting position and the third connecting position; forming a wiring conductive layer on the base conductive layer by electrolytic plating by feeding power from the external power source; and removing the power-feed wiring portion and the connection wiring portion.

First claim

What is claimed is:

1 . A method for manufacturing a planar coil, the method comprising:
forming a base conductive layer on a base material, the base conductive layer including:
a coil wiring portion having one end, other end, and first to third connecting positions, the second connecting position being closer to the other end compared with the first connecting position, the third connecting position being closer to the one end compared with the second connecting position;
a power-feed wiring portion that connects the first connecting position with an external power source; and
a connection wiring portion that short-circuits the second connecting position and the third connecting position;
forming a wiring conductive layer on the base conductive layer by electrolytic plating by feeding power from the external power source; and removing the power-feed wiring portion and the connection wiring portion.

2 . The method for manufacturing the planar coil as claimed in claim 1 , further comprising:
forming a base resin layer on the base material before forming the base conductive layer, wherein the forming the base conductive layer is performed by electroless plating to form the base conductive layer on the base resin layer.

3 . The method for manufacturing the planar coil as claimed in claim 1 , wherein the removing is performed by physically removing a part of the base material together with the power-feed wiring portion and the connection wiring portion.

4 . The method for manufacturing the planar coil as claimed in claim 1 , wherein the removing is performed by etching the base conductive layer and the wiring conductive layer constituting the power-feed wiring portion and the connection wiring portion.

5 . The method for manufacturing the planar coil as claimed in claim 1 ,
wherein the coil wiring portion includes a spiral pattern, and wherein the one end and the other end of the coil wiring portion are an outer peripheral end and an inner peripheral end of the spiral pattern, respectively.

6 . The method for manufacturing the planar coil as claimed in claim 5 , wherein the first connecting position is apart from the outer peripheral end and located on an outermost turn of the spiral pattern.

7 . The method for manufacturing the planar coil as claimed in claim 5 , wherein the second connecting position is located at the inner peripheral end of the spiral pattern.

8 . The method for manufacturing the planar coil as claimed in claim 7 , wherein the third connecting position is located at a cross point of an innermost turn of the spiral pattern and an extension line extending from the inner peripheral end in a winding direction.

9 . The method for manufacturing the planar coil as claimed in claim 1 , wherein the base material comprises a resin film.

10 . The method for manufacturing the planar coil as claimed in claim 2 , wherein the base resin layer includes at least one of metal selected from Pd, Cu, Ni, Ag, Pt, and Au.

11 . The method for manufacturing the planar coil as claimed in claim 1 , wherein each of the base conductive layer and the wiring conductive layer comprises at least one of metal selected from Cu, Ag, and Au, respectively.

Assignees

• Tdk Corp

Inventors

• Horikawa Yuhei
• Orikasa Makoto
• Kanbayashi Yoshihiro
• Abe Hisayuki
• Asou Hirohumi
• Kunitsuka Kosuke

Classifications

• H05K3/241

  characterised by the electroplating method; means therefor, e.g. baths or apparatus · CPC title

• H01F41/04

  for manufacturing coils {(coils for transformer or inductances H01F27/28)} · CPC title

• C25D13/12

  characterised by the article coated · CPC title

• H01F41/041 Primary

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title

• H01Q7/00

  Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop · CPC title