Contacting Embedded Electronic Component Via Wiring Structure in a Component Carrier's Surface Portion With Homogeneous Ablation Properties

Patent metadata

Field	Value
Publication number	US-2017330837-A1
Application number	US-201515536607-A
Country	US
Kind code	A1
Filing date	Dec 16, 2015
Priority date	Dec 16, 2014
Publication date	Nov 16, 2017
Grant date	—

Abstract

A component carrier for carrying electronic components, wherein the component carrier comprises an at least partially electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end, wherein the at least one electronic component is electrically contacted directly to the component contacting end, wherein at least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure, and wherein the wiring contacting end is electrically contacted directly to the wiring structure.

First claim

1 . A component carrier for carrying electronic components, the component carrier comprising:
an at least partially electrically insulating core; at least one electronic component embedded in the core; a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end; wherein the at least one electronic component electrically contacted directly to the component contacting end; wherein at least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure; wherein the wiring contacting end is electrically contacted directly to the wiring structure.

2 . The component carrier according to claim 1 , embodied as one of the group consisting of a circuit board, a substrate, and an interposer,
wherein the electronic component is selected from a group consisting of an active electronic component, a passive electronic component, an electronic chip, a storage device, a filter, a sensor, an actuator, a microelectromechanical system, a microprocessor, a capacitor, a resistor, an inductance, a battery and a logic chip, wherein electrically insulating material of the core comprises at least one of the group consisting of resin, Bismaleimide-Triazine resin, glass fibers, prepreg material, polyimide, liquid crystal polymer, epoxy-based Build-Up Film, and FR4 material.

3 .- 4 . (canceled)

5 . The component carrier according to claim 1 , wherein at least the exterior surface portion of the coupling structure is made of a material free of glass fibres.

6 . The component carrier according to claim 1 , wherein at least the exterior surface portion of the coupling structure comprises at least one of the group consisting of a pure resin, a palladium doped resin, a copper oxide doped resin, and a photoresist, a permanent resist,
wherein the at least one through-connection comprises at least one pillar, at least one circular cylindrical pillar and/or a plurality of pillars aligned in parallel to one another.

7 . (canceled)

8 . The component carrier according to claim 1 , wherein an exterior surface of the wiring structure substantially flushes with an exterior surface of the exterior surface portion of the coupling structure.

9 . The component carrier according to claim 1 , comprising at least one further electrically conductive wiring structure on a main surface of the component carrier opposing another main surface thereof, at which other main surface the exterior surface portion of the coupling structure and the wiring structure are located.

10 . The component carrier according to claim 1 , comprising an adhesive structure covering at least part of an interface between the coupling structure and the at least one electronic component embedded in the core.

11 . The component carrier according to claim 1 , wherein at least one of the wiring structure, and the at least one through-connection comprises or consists of at least one of the group consisting of copper, aluminum, and nickel.

12 . The component carrier according to claim 1 , wherein dielectric material of the coupling structure comprises a matrix and filler particles embedded in the matrix, wherein the material of the matrix and of the filler particles together define the homogeneous ablation properties of the exterior surface portion of the coupling structure;
wherein the filler particles are selected from a group consisting of beads, glass spheres, and organic fibres.

13 . (canceled)

14 . The component carrier according to claim 1 , wherein a lateral extension of traces of the wiring structure narrower than a lateral extension of the at least one through-connection.

15 . The component carrier according to claim 1 , wherein a lateral extension of traces of the wiring structure is broader than a lateral extension of the at least one through-connection.

16 . The component carrier according to claim 1 , wherein the at least one through-connection has a cylindrical shape with an aspect ratio of larger than 1.

17 . The component carrier according to claim 1 , wherein the coupling structure comprises or consists of a prefabricated, separate coupling body.

18 . The component carrier according to claim 1 , wherein the component carrier comprises at least one of the group consisting of the following features:
comprises or consists of a combination of a coupling body and a coupling layer being arranged at least partially on the coupling body; an electric interface between the at least one electronic component and the at least one through-connection is free of a redistribution layer; and the at least one electronic component and at least part of the coupling structure are integrally formed in a semiconductor substrate.

19 .- 20 . (canceled)

21 . A method of manufacturing a component carrier for carrying electronic components, the method comprising:
embedding at least one electronic component in an at least partially electrically insulating core; providing a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and being formed with a component contacting end and a wiring contacting end; electrically contacting the at least one electronic component directly to the component contacting end; providing at least an exterior surface portion of the coupling structure with homogeneous ablation properties; patterning the exterior surface portion so as to form surface recesses; and filling the surface recesses with an electrically conductive wiring structure so that the wiring contacting end is electrically contacted directly to the wiring structure.

22 . The method according to claim 21 , further comprising:
connecting the at least one electronic component to at least part of the coupling structure prior to embedding the at least one electronic component in the core.

23 . The method according to claim 21 , further comprising:
providing a soft adhesive structure between the at least one electronic component and the at least one component contact end at an exposed surface of the coupling; and pressing the at least one electronic component and at least part of the coupling structure together to thereby squeeze the soft adhesive away from a contact area between the component contact end and an electric contact of the at least one electronic component.

24 . The method according to claim 21 , wherein wherein the method further comprises at least one of the group consisting of the following features:
forming the surface recesses by at least one of laser drilling and etching, in particular by at least one of photolithographic etching and reactive ion etching; forming at least one accommodation volume within the core; accommodating the at least one electronic component in at least part of the at least one accommodation volume; connecting the core with the at least one electronic component by pressing; and fully embedding the wiring structure within the surface portion of the coupling structure without protruding beyond the surface portion.

25 .- 26 . (canceled)

27 . The method according to claim 21 ,
wherein the patterning and the filling are carried out so that the wiring structure is directly electrically connected to the at least one wiring contac

Assignees

• Austria Tech & System Tech

Inventors

• Stahr Hannes

Classifications

• H10W90/794

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title