Plating apparatus, plating method and storage medium

Patent metadata

Field	Value
Publication number	US-9777379-B2
Application number	US-201214129698-A
Country	US
Kind code	B2
Filing date	Jun 4, 2012
Priority date	Jun 29, 2011
Publication date	Oct 3, 2017
Grant date	Oct 3, 2017

Abstract

A plating apparatus can perform a plating process on an entire surface of a substrate uniformly. A plating apparatus 20 includes a substrate holding/rotating device 110 configured to hold and rotate a substrate 2 ; a discharging device 21 configured to discharge a plating liquid toward the substrate 2 held on the substrate holding/rotating device 110 ; and a controller 160 configured to control the substrate holding/rotating device 110 and the discharging device 21 . Further, the discharging device 21 includes a first nozzle 40 having a multiple number of discharge openings 41 arranged in a radial direction of the substrate 2 or having a discharge opening 42 extended in the radial direction of the substrate 2 ; and a second nozzle 45 having a discharge opening 46 configured to be positioned closer to a central portion of the substrate 2 than the discharge opening of the first nozzle 40.

First claim

What is claimed is:

1. A plating method of performing a plating process by supplying a plating liquid onto a substrate, the plating method comprising:
loading the substrate on a substrate holding/rotating device;
forming a first plating layer on the substrate by discharging a first plating liquid onto the substrate;
supplying a pre-treatment liquid for performing a pre-treatment onto the substrate; and
discharging, after the pre-treatment liquid is supplied onto the substrate, a second plating liquid toward the substrate through a discharging device,
wherein the discharging device includes a first nozzle having a multiple number of discharge openings arranged in a radial direction of the substrate or having a discharge opening extended in the radial direction of the substrate; and a second nozzle having a discharge opening configured to be positioned closer to a central portion of the substrate than the discharge opening of the first nozzle, and
the second plating liquid is discharged toward the substrate from at least one of the first nozzle and the second nozzle, and
wherein the discharging of the second plating liquid toward the substrate through the discharging device includes a first process of discharging the second plating liquid toward the substrate to displace the pre-treatment liquid previously supplied onto the substrate by the second plating liquid; and a second process of discharging the second plating liquid toward the substrate after the first process to form a second plating layer on the first plating layer,
in the first process, the second plating liquid is discharged toward the substrate at least through the second nozzle,
in the second process, the second plating liquid is discharged toward the substrate through the first and second nozzles,
the discharge opening of the second nozzle includes an inclined discharge opening configured to discharge the second plating liquid toward the substrate in an inclined direction that is inclined with respect to the normal direction of the substrate,
in the second process, the substrate is being rotated in a first rotational direction corresponding to the inclined direction to decrease an impact applied to the substrate by the second plating liquid such that a thickness of the second plating layer on the central portion of the substrate is suppressed from being smaller than a thickness of the second plating layer on a peripheral portion of the substrate, and
in the first process, the substrate is being rotated in a second rotational direction reverse to the first rotational direction to increase an impact applied to the substrate by the second plating liquid such that a force by which the second plating liquid pushes the pre-treatment liquid is increased.

2. The plating method of claim 1 ,
wherein,
a discharge rate of the second plating liquid discharged from the second nozzle toward the substrate in a normal direction of the substrate in the second process is set to be smaller than a discharge rate of the second plating liquid discharged from the second nozzle toward the substrate in the normal direction of the substrate in the first process.

3. The plating method of claim 1 ,
wherein,
the second nozzle is configured to be moved between a central position, where the discharge opening of the second nozzle is positioned closer to the central portion of the substrate than the discharge opening of the first nozzle, and a peripheral position outer than the central position,
in the first process, the second nozzle discharges the second plating liquid toward the substrate while the second nozzle is being moved from the central position to the peripheral position, and
in the second process, the second nozzle discharges the second plating liquid toward the substrate while the second nozzle is being moved from the peripheral position to the central position.

4. The plating method of claim 1 ,
wherein a temperature of the second plating liquid supplied from the first nozzle toward the substrate is set to be higher than a temperature of the second plating liquid supplied from the second nozzle toward the substrate.

Assignees

• Inatomi Yuichiro
• Tanaka Takashi
• Iwashita Mitsuaki
• Tokyo Electron Ltd

Inventors

• Inatomi Yuichiro
• Tanaka Takashi
• Iwashita Mitsuaki

Classifications

• C23C18/1632

  Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells · CPC title

• C23C18/1676

  Heating of the solution · CPC title

• C23C18/1655

  Process features · CPC title

• C23C18/18

  Pretreatment of the material to be coated · CPC title

• C23C18/163 Primary

  Supporting devices for articles to be coated · CPC title