Method of fabricating a bath of electrolyte for plating a platinum-based metallic underlayer on a metallic substrate
US-9752243-B2 · Sep 5, 2017 · US
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Patent family 47002945
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 47002945 |
| Family type | — |
| Earliest priority | Apr 19, 2012 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US9752243B2 — Method of fabricating a bath of electrolyte for plating a platinum-based metallic underlayer on a metallic substrate |
Representative publication
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US9752243B2 — Method of fabricating a bath of electrolyte for plating a platinum-based metallic underlayer on a metallic substrate (published Sep 5, 2017)
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