Direct liquid injection for halide vapor phase epitaxy systems and methods

Patent metadata

Field	Value
Publication number	US-9644285-B2
Application number	US-201213591803-A
Country	US
Kind code	B2
Filing date	Aug 22, 2012
Priority date	Aug 22, 2011
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

Methods of depositing compound semiconductor materials on one or more substrates include metering and controlling a flow rate of a precursor liquid from a precursor liquid source into a vaporizer. The precursor liquid may comprise at least one of GaCl 3 , InCl 3 , and AlCl 3 in a liquid state. The precursor liquid may be vaporized within the vaporizer to form a first precursor vapor. The first precursor vapor and a second precursor vapor may be caused to flow into a reaction chamber, and a compound semiconductor material may be deposited on a surface of a substrate within the reaction chamber from the precursor vapors. Deposition systems for performing such methods include devices for metering and/or controlling a flow of a precursor liquid from a liquid source to a vaporizer, while the precursor liquid remains in the liquid state.

First claim

What is claimed is:

1. A method of depositing a compound semiconductor material on a substrate using a halide vapor phase epitaxy system, comprising:
metering and controlling a flow rate of a precursor liquid from a source of the precursor liquid into a vaporizer, the precursor liquid comprising at least one of GaCl 3 , InCl 3 , and AlCl 3 in a liquid state;
maintaining a temperature of the precursor liquid within a range extending from about 90° C. to about 100° C. between the source of the precursor liquid and the vaporizer;
heating the precursor liquid within the vaporizer to at least about 400° C. and vaporizing the precursor liquid within the vaporizer to form a first precursor vapor;
flowing the first precursor vapor out from the vaporizer, through a precursor gas furnace disposed at least partially within a reaction chamber, and to a region proximate a surface of a workpiece substrate within the reaction chamber, the precursor gas furnace comprising:
a stack of plate-shaped structures;
a first chamber defined between two plate-shaped structures in the stack of plate-shaped structures, ridge-shaped protrusions on one of the two plate-shaped structures defining the first chamber subdividing the first chamber into one or more flowpaths for the first precursor vapor extending between an inlet to the first chamber at a first end of the precursor gas furnace and an outlet from the first chamber at a second opposing end of the precursor gas furnace, the one or more flowpaths in the first chamber having a serpentine configuration;
a second chamber defined between two plate-shaped structures in the stack of plate-shaped structures, the outlet of the first chamber leading to an inlet of the second chamber, the second chamber having a cross-sectional shape that is generally rectangular and uniform in size between the inlet of the second chamber and an outlet of the second chamber such that the flow of the first precursor vapor through the second chamber is generally laminar; and
a third chamber defined between two plate-shaped structures in the stack of plate-shaped structures, the outlet of the second chamber leading to an inlet of the third chamber, the third chamber having a cross-sectional shape that is generally rectangular and uniform in size between the inlet of the third chamber and an outlet of the third chamber such that flow of the first precursor vapor through the third chamber is generally laminar;

separately flowing a second precursor vapor into the reaction chamber; and
depositing a compound semiconductor material on the surface of the workpiece substrate within the reaction chamber, the compound semiconductor material comprising at least one element from the first precursor vapor and at least one element from the second precursor vapor.

2. The method of claim 1 , wherein metering and controlling the flow rate of the precursor liquid into the vaporizer comprises metering the flow rate with a first device, and controlling the flow rate with a second device separate from the first device.

3. The method of claim 1 , wherein metering and controlling the flow rate of the precursor liquid into the vaporizer comprises metering and controlling the flow rate with a single unitary device.

4. The method of claim 1 , wherein maintaining the temperature of the precursor liquid within the range extending from about 83° C. to about 150° C. between the liquid source and the vaporizer comprises maintaining a temperature of the precursor liquid within a range extending from about 85° C. to about 120° C. between the liquid source and the vaporizer.

5. The method of claim 4 , wherein maintaining the temperature of the precursor liquid within the range extending from about 85° C. to about 120° C. between the liquid source and the vaporizer comprises maintaining a temperature of the precursor liquid within a range extending from about 90° C. to about 100° C. between the liquid source and the vaporizer.

6. The method of claim 1 , further comprising flowing the precursor liquid from the liquid source to the vaporizer without decreasing a temperature of the precursor liquid.

7. The method of claim 6 , wherein flowing the precursor liquid from the liquid source to the vaporizer without decreasing the temperature of the precursor liquid comprises increasing a temperature of the precursor liquid as the precursor liquid flows from the liquid source to the vaporizer.

8. The method of claim 1 , further comprising formulating the precursor liquid to comprise GaCl 3 .

9. The method of claim 1 , further comprising formulating the second precursor vapor to comprise nitrogen.

10. The method of claim 9 , wherein formulating the second precursor vapor to comprise nitrogen comprises formulating the second precursor vapor to comprise ammonia.

11. The method of claim 1 , wherein depositing the compound semiconductor material comprises depositing at least one of gallium nitride, indium nitride, and aluminum nitride.

12. The method of claim 1 , wherein vaporizing the precursor liquid within the vaporizer comprises vaporizing the precursor liquid within an interior region of the reaction chamber.

13. The method of claim 1 , further comprising heating the first precursor vapor within the vaporizer to a temperature of at least about 850° C.

14. A halide vapor phase epitaxy system, comprising:
a reaction chamber including at least one substrate support structure within the reaction chamber;
a source of a precursor liquid comprising at least one of GaCl 3 , InCl 3 , and AlCl 3 in a liquid state;
a vaporizer vaporizing the precursor liquid and forming a precursor vapor conveyed to a location proximate the substrate support structure within the reaction chamber;
at least one conduit providing a fluid pathway for the precursor liquid between the source of the precursor liquid and the vaporizer;
a flow meter device metering a flow rate of the precursor liquid through the at least one conduit;
a flow control device controlling the flow rate of the precursor liquid through the at least one conduit; and
a precursor gas furnace disposed at least partially within the reaction chamber and in fluid communication with the vaporizer such that the precursor vapor formed by the vaporizer is communicated to the precursor gas furnace, the precursor gas furnace comprising:
a stack of plate-shaped structures;
a first chamber defined between two plate-shaped structures in the stack of plate-shaped structures, ridge-shaped protrusions on one of the two plate-shaped structures defining the first chamber subdividing the first chamber into one or more precursor gas flowpaths extending between an inlet to the first chamber at a first end of the precursor gas furnace and an outlet from the first chamber at a second opposing end of the precursor gas furnace, the one or more precursor gas flowpaths in the first chamber having a serpentine configuration;
a second chamber defined between two plate-shaped structures in the stack of plate-shaped structures, the outlet of the first chamber leading to an inlet of the second chamber, the second chamber having a cross-sectional shape that is generally rectangular and uniform in size between the inlet of the second chamber and an outlet of the second chamber such that gas flow through the second chamber is generally laminar; and
a third chamber defined between two plate-shaped structures in the stack of plate-shaped structures, the outlet of the second chamber leading to an inlet of the third chamber, the third chamber having a cross-sectional shape that is generally rectangular and uniform in size between the inlet of the third chamber and an out

Assignees

• Bertram Jr Ronald Thomas
• Soitec Silicon On Insulator

Inventors

• Bertram Jr Ronald Thomas

Classifications

• C30B23/005 Primary

  Controlling or regulating flux or flow of depositing species or vapour · CPC title

• C23C16/303

  Nitrides · CPC title

• C23C16/4557

  Heated nozzles · CPC title

• C30B29/403

  AIII-nitrides · CPC title

• C23C16/4486

  by producing an aerosol and subsequent evaporation of the droplets or particles · CPC title