Showerhead assembly and substrate processing apparatus
US-2024042463-A1 · Feb 8, 2024 · US
Heated nozzles
Heated nozzles · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C23C16/4557 |
| Official title | {Heated nozzles} |
| Display label | Heated nozzles |
| Total patents | 412 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 27 |
| 2016 | 15 |
| 2017 | 25 |
| 2018 | 22 |
| 2019 | 39 |
| 2020 | 47 |
| 2021 | 33 |
| 2022 | 49 |
| 2023 | 48 |
| 2024 | 49 |
| 2025 | 38 |
| 2026 | 20 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
CVI densification installation including a high capacity preheating zone
US-9845534-B2 · Dec 19, 2017 · US
Device for depositing a layer on a substrate
US-2017327938-A1 · Nov 16, 2017 · US
PECVD process
US-9816187-B2 · Nov 14, 2017 · US
Apparatus for controlling temperature uniformity of a showerhead
US-2017304849-A1 · Oct 26, 2017 · US
Gas jetting apparatus for film formation apparatus
US-2017275758-A1 · Sep 28, 2017 · US
System and method for enhancing a diffusion limited cvi/cvd process
US-2017268102-A1 · Sep 21, 2017 · US
Common Terminal Heater for Ceramic Pedestals Used in Semiconductor Fabrication
US-2017236733-A1 · Aug 17, 2017 · US
Method for manufacturing compound semiconductor epitaxial substrates including heating of carrier gas
US-9711353-B2 · Jul 18, 2017 · US
Methods For Depositing Fluorine/Carbon-Free Conformal Tungsten
US-2017194156-A1 · Jul 6, 2017 · US
Direct liquid injection for halide vapor phase epitaxy systems and methods
US-9644285-B2 · May 9, 2017 · US
Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer readable recording medium
US-9644265-B2 · May 9, 2017 · US
Apparatus for dielectric deposition process
US-9631273-B2 · Apr 25, 2017 · US
Chemical vapor deposition apparatus and method for manufacturing semiconductor device using the same
US-2017110318-A1 · Apr 20, 2017 · US
Diffuser temperature control
US-2017096738-A1 · Apr 6, 2017 · US
Heated showerhead assembly
US-9570275-B2 · Feb 14, 2017 · US
Pecvd process
US-2017016118-A1 · Jan 19, 2017 · US
A cvi densification installation including a high capacity preheating zone
US-2017002466-A1 · Jan 5, 2017 · US
Method of manufacturing semiconductor device
US-9508546-B2 · Nov 29, 2016 · US
Corrosion resistant gas distribution manifold with thermally controlled faceplate
US-2016343595-A1 · Nov 24, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C23C16/4557?
- CPC C23C16/4557 is the Cooperative Patent Classification code for “Heated nozzles.”
- How many patents are filed under CPC C23C16/4557 (Heated nozzles)?
- Our database includes 412 publications tagged with this CPC code.
- Is patent activity under CPC C23C16/4557 growing?
- Publication counts under this code: 49 in 2024 vs 38 in 2025 (latest complete years).