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Bonding method, bonding apparatus and bonding system
US9165803B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9165803-B2 |
| Application number | US-201414254966-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 17, 2014 |
| Priority date | May 1, 2013 |
| Publication date | Oct 20, 2015 |
| Grant date | Oct 20, 2015 |
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- Title
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Abstract
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A bonding method according to an exemplary embodiment of the present disclosure includes a first holding processing, a second holding processing, a temporary bonding processing, a temperature increasing processing and a main bonding processing. In the first holding processing, a target substrate is held. In the second holding processing, a glass substrate held by electrostatic adsorption. In the temporary bonding processing, the target substrate and the glass substrate are temporarily bonded with a pressing force lower than a predetermined pressing force at a temperature lower than a predetermined temperature. In the temperature increasing processing, while releasing the electrostatic adsorption of the glass substrate at the same time as or after the temporary bonding, the temperature is increased to the predetermined temperature. In the main bonding processing, a main bonding of the target substrate and the glass substrate is performed with the predetermined pressing force.
First claim
Opening claim text (preview).
What is claimed is: 1. A bonding method comprising: holding a target substrate; holding a glass substrate by electrostatic adsorption; after the holding of the target substrate and the glass substrate, temporarily bonding the target substrate and the glass substrate with a pressing force lower than a predetermined pressing force at a temperature lower than a predetermined temperature; while releasing the electrostatic adsorption of the glass substrate at the same time as or…
Assignees
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10P72/0428Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
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Frequently asked questions
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- What does patent US9165803B2 cover?
- A bonding method according to an exemplary embodiment of the present disclosure includes a first holding processing, a second holding processing, a temporary bonding processing, a temperature increasing processing and a main bonding processing. In the first holding processing, a target substrate is held. In the second holding processing, a glass substrate held by electrostatic adsorption. In th…
- Who is the assignee on this patent?
- Tokyo Electron Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0428. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 20 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).