Semiconductor Package and Method of Manufacturing The Same
US-2024387196-A1 · Nov 21, 2024 · US
Wafer processing method
US2024395620A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024395620-A1 |
| Application number | US-202418664720-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 15, 2024 |
| Priority date | May 24, 2023 |
| Publication date | Nov 28, 2024 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A wafer processing method for processing a wafer includes a reverse side which has an annular protruding portion on an outer circumferential portion thereof and a circular recessed portion in a region surrounded by the annular protruding portion on the reverse side, in which a sheet including no glue layer is fixed to a face side of the wafer and an annular frame is fixed to an outer circumferential portion of the sheet to form a wafer unit, the wafer is held on a holding table via the sheet, a dividing groove is formed in the circular recessed portion of the wafer, the annular protruding portion is separated from the wafer, and the annular protruding portion is removed from the sheet.
First claim
Opening claim text (preview).
What is claimed is: 1 . A wafer processing method for processing a wafer including a reverse side which has an annular protruding portion on an outer circumferential portion thereof and a circular recessed portion in a region surrounded by the annular protruding portion, the wafer processing method comprising: a wafer unit forming step of forming a wafer unit by fixing a sheet including no glue layer to a face side of the wafer and fixing an annular frame to an outer circumferen…
Assignees
Inventors
Classifications
- H10P72/7402Primary
Electricity · mapped topic
- H10P54/00Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
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Frequently asked questions
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- What does patent US2024395620A1 cover?
- A wafer processing method for processing a wafer includes a reverse side which has an annular protruding portion on an outer circumferential portion thereof and a circular recessed portion in a region surrounded by the annular protruding portion on the reverse side, in which a sheet including no glue layer is fixed to a face side of the wafer and an annular frame is fixed to an outer circumfere…
- Who is the assignee on this patent?
- Disco Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P72/7402. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Nov 28 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).