Wafer processing method
US-2024395620-A1 · Nov 28, 2024 · US
Method for manufacturing electronic device
US2024258152A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024258152-A1 |
| Application number | US-202218564419-A |
| Country | US |
| Kind code | A1 |
| Filing date | May 27, 2022 |
| Priority date | May 28, 2021 |
| Publication date | Aug 1, 2024 |
| Grant date | — |
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Abstract
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A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from the wafer after the adhesive film is irradiated with an ultraviolet ray. This adhesive film includes a base material layer, and an adhesive resin layer which is provided on one surface side of the base material layer and configured with an ultraviolet curable adhesive resin material. In the step (C), regarding the adhesive resin layer of the adhesive film after being irradiated with an ultraviolet ray, a storage elastic modulus at 100° C. is 2.0×10 −3 to 1.5 ×10 −2 .
First claim
Opening claim text (preview).
1 . A method for manufacturing an electronic device, the method at least comprising: a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer; a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of irradiating the adhesive film with an ultraviolet ray and then removing the adhesive film from the wafer, whe…
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
- H10P72/7402Primary
Electricity · mapped topic
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- What does patent US2024258152A1 cover?
- A method for manufacturing an electronic device at least includes a step (A) of preparing a structure which includes a wafer including a circuit forming surface, and an adhesive film bonded to the circuit forming surface side of the wafer, a step (B) of back-grinding a surface of the wafer on a side opposite to the circuit forming surface side; and a step (C) of removing the adhesive film from …
- Who is the assignee on this patent?
- Mitsui Chemicals Tohcello Inc
- What technology area does this patent fall under?
- Primary CPC classification H10P72/7402. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Aug 01 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).