Stiffener architectures for glass edge protection

Patent metadata

Field	Value
Publication number	US-2025106983-A1
Application number	US-202318373457-A
Country	US
Kind code	A1
Filing date	Sep 27, 2023
Priority date	Sep 27, 2023
Publication date	Mar 27, 2025
Grant date	—

Abstract

Embodiments disclosed herein include glass core package substrates with a stiffener. In an embodiment, an apparatus comprises a substrate with a first layer with a first width, where the first layer is a glass layer, a second layer under the first layer, where the second layer has a second width that is smaller than the first width, and a third layer over the first layer, where the third layer has a third width that is smaller than the first width. In an embodiment, the apparatus further comprises a metallic structure with a first portion and a second portion, where the first portion is over a top surface of the substrate and the second portion extends away from the first portion and covers at least a sidewall of the first layer.

First claim

What is claimed is:

1 . An apparatus, comprising:
a substrate, comprising:
a first layer with a first width, wherein the first layer is a glass layer;
a second layer under the first layer, wherein the second layer has a second width that is smaller than the first width; and
a third layer over the first layer, wherein the third layer has a third width that is smaller than the first width; and
a metallic structure with a first portion and a second portion, wherein the first portion is over a top surface of the substrate and the second portion extends away from the first portion and covers at least a sidewall of the first layer.

2 . The apparatus of claim 1 , further comprising:
an adhesive between the metallic structure and the substrate.

3 . The apparatus of claim 1 , wherein the metallic structure is a stiffener.

4 . The apparatus of claim 1 , wherein a first end of the first layer and a second end of the first layer extend past sidewalls of the second layer and the third layer.

5 . The apparatus of claim 1 , wherein the first portion of the metallic structure is a ring around an outer edge of the top surface of the substrate.

6 . The apparatus of claim 1 , wherein a fold is provided between the second portion and the first portion.

7 . The apparatus of claim 1 , wherein the second portion covers an entire sidewall of the substrate, and wherein the metallic structure further comprises:
a third portion, wherein the third portion extends laterally away from the second portion and is positioned under the substrate.

8 . The apparatus of claim 7 , wherein the second portion is curved.

9 . The apparatus of claim 1 , wherein the second layer and the third layer both comprise organic buildup layers and a solder resist layer.

10 . The apparatus of claim 1 , wherein the first layer has a thickness between 100 μm and 1,000 μm.

11 . An apparatus, comprising:
a first layer, wherein the first layer comprises a solid glass rectangular prism; a second layer under the first layer; a third layer over the first layer, wherein an end of the first layer extends past an end of the second layer and past an end of the third layer; and a stiffener with a first portion under the second layer and a second portion over the third layer, wherein an end of the stiffener is substantially coplanar with the end of the first layer.

12 . The apparatus of claim 11 , further comprising:
an adhesive between the first portion of the stiffener and the second portion of the stiffener, wherein the adhesive directly contacts the first layer.

13 . The apparatus of claim 12 , wherein the adhesive is electrically conductive.

14 . The apparatus of claim 11 , wherein the stiffener extends over surfaces of the second layer and the third layer.

15 . The apparatus of claim 11 , wherein the first portion of the stiffener has a first width and the second portion of the stiffener has a second width that is substantially equal to the first width.

16 . The apparatus of claim 11 , wherein the second layer and the third layer both comprise organic buildup layers and a solder resist layer.

17 . The apparatus of claim 11 , wherein the first layer has a thickness between 100 μm and 1,000 μm.

18 . An apparatus, comprising:
a board; a package substrate coupled to the board, wherein the package substrate comprises a glass core; a stiffener on the package substrate, wherein the stiffener includes vertical portions that cover sidewalls of at least the glass core; and a die coupled to the package substrate, wherein the stiffener surrounds an outer perimeter of the die.

19 . The apparatus of claim 18 , wherein the stiffener wraps completely around a sidewall of the package substrate and covers at least a portion of a bottom of the package substrate.

20 . The apparatus of claim 18 , wherein the apparatus is part of a personal computer, a server, a mobile device, a tablet, or an automobile.

Assignees

• Intel Corp

Inventors

• Shan Bohan
• Arrington Kyle
• Xu Dingying David
• Lin Ziyin
• Gosselin Timothy
• Bozorg-Grayeli Elah
• Antoniswamy Aravindha
• Li Wei
• Chen Haobo
• Bai Yiqun
• Waimin Jose
• Carrazzone Ryan
• Feng Hongxia
• Pietambaram Srinivas Venkata Ramanuja
• Duan Gang
• Mu Bin
• Gupta Mohit
• Ecton Jeremy D
• Marin Brandon C
• Guo Xiaoying
• Dani Ashay

Classifications

• H05K1/0306

  Inorganic insulating substrates, e.g. ceramic, glass · CPC title

• H05K2201/2009

  Reinforced areas, e.g. for a specific part of a flexible printed circuit · CPC title

• H05K1/0271 Primary

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title