Methods and apparatus using polymer material to fill gaps between semiconductor dies
US-2025279384-A1 · Sep 4, 2025 · US
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Dani Ashay patents
Dani Ashay is listed as an inventor on 13 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Dani Ashay |
| Total patents | 13 |
| First publication | Jan 26, 2016 |
| Latest publication | Sep 4, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Passive component assembly for thickness modification to match core thickness
US-2025218999-A1 · Jul 3, 2025 · US
Pedestals for semiconductor components embedded in package substrates and related methods
US-2025218958-A1 · Jul 3, 2025 · US
Microelectronic assemblies including cavity-less encapsulated dies
US-2025218926-A1 · Jul 3, 2025 · US
Low temperature solder interconnect for package pitch scaling
US-2025218998-A1 · Jul 3, 2025 · US
Glass core protection using peripheral buffer layers
US-2025112136-A1 · Apr 3, 2025 · US
Apparatus and methods for capillary underfill of embedded devices
US-2025112085-A1 · Apr 3, 2025 · US
Stiffener architectures for glass edge protection
US-2025106983-A1 · Mar 27, 2025 · US
Methods and apparatus for optical thermal treatment in semiconductor packages
US-2024222301-A1 · Jul 4, 2024 · US
Methods and apparatus to prevent over-etch in semiconductor packages
US-2024222283-A1 · Jul 4, 2024 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 12 |
| Intel Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/701 | 7 |
| H10W90/724 | 6 |
| H10W70/685 | 6 |
| H10W70/65 | 6 |
| H10W90/00 | 6 |