Methods and architectures for shallow fiducial and metal defined pad designs
US-2025273607-A1 · Aug 28, 2025 · US
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Mu Bin patents
Mu Bin is listed as an inventor on 25 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mu Bin |
| Total patents | 25 |
| First publication | Mar 30, 2017 |
| Latest publication | Aug 28, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Microelectronic assemblies with pillar-first conductive via formation in glass cores
US-2025218880-A1 · Jul 3, 2025 · US
Microelectronic assemblies including cavity-less encapsulated dies
US-2025218926-A1 · Jul 3, 2025 · US
Low temperature solder interconnect for package pitch scaling
US-2025218998-A1 · Jul 3, 2025 · US
Microelectronic assemblies with strengthened glass cores
US-2025210426-A1 · Jun 26, 2025 · US
Microelectronic assemblies with post-singulation edge features in glass cores
US-2025192070-A1 · Jun 12, 2025 · US
Microelectronic assemblies with pre-singulation edge features in glass cores
US-2025192069-A1 · Jun 12, 2025 · US
Embedded bridge with through silicon via bonding architectures
US-2025192059-A1 · Jun 12, 2025 · US
Direct bonding for embedded bridges with vias
US-2025183180-A1 · Jun 5, 2025 · US
Controlling substrate bump height
US-2025112164-A1 · Apr 3, 2025 · US
Recent patents
Latest publications not already listed above.
Apparatus and methods for capillary underfill of embedded devices
US-2025112085-A1 · Apr 3, 2025 · US
Glass core protection using peripheral buffer layers
US-2025112136-A1 · Apr 3, 2025 · US
Stiffener architectures for glass edge protection
US-2025106983-A1 · Mar 27, 2025 · US
Optical semiconductor package and method
US-2024219660-A1 · Jul 4, 2024 · US
Enabling copper recess flattening through blocked copper etching processes
US-2024222130-A1 · Jul 4, 2024 · US
Dry film photoresist wet lamination and method
US-2024203853-A1 · Jun 20, 2024 · US
Glass layer with litho defined through-glass via
US-2024203806-A1 · Jun 20, 2024 · US
Two-dimensional metal-organic framework alloy photocatalysts
US-11753731-B2 · Sep 12, 2023 · US
Biosensor array for the detection of analytes
US-11672449-B2 · Jun 13, 2023 · US
Biosensor array for the detection of analytes
US-11185263-B2 · Nov 30, 2021 · US
Metal-organic framework-based sorbents and methods of synthesis thereof
US-10413858-B2 · Sep 17, 2019 · US
Phototunable metal-organic framework compositions, and methods of synthesis thereof
US-9716239-B2 · Jul 25, 2017 · US
Metal-organic framework-based sorbents and methods of synthesis thereof
US-2017182453-A1 · Jun 29, 2017 · US
Metal-organic framework composites, and methods of synthesis thereof
US-2017145599-A1 · May 25, 2017 · US
Phototunable metal-organic framework compositions, and methods of synthesis thereof
US-2017092879-A1 · Mar 30, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 16 |
| Univ Arizona State | 8 |
| Mu Bin | 3 |
| Labelle Jeffrey | 2 |
| Probst David | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/692 | 11 |
| H10W70/685 | 10 |
| H10W70/611 | 9 |
| H01L24/16 | 9 |
| H10W70/635 | 9 |