Glass etch protection and seware reduction by coating protection
US-2026090431-A1 · Mar 26, 2026 · US
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Marin Brandon C patents
Marin Brandon C is listed as an inventor on 224 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Marin Brandon C |
| Total patents | 224 |
| First publication | Dec 22, 2016 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Edge coating for glass core substrate with a frame
US-2026090430-A1 · Mar 26, 2026 · US
Edge coating for glass core substrate with air pressing for profile control
US-2026090429-A1 · Mar 26, 2026 · US
Singulation incorporating an etched metal channel
US-2026090424-A1 · Mar 26, 2026 · US
Embedded channels in a glass core
US-2026090410-A1 · Mar 26, 2026 · US
Socket assemblies for semiconductor devices
US-2026086114-A1 · Mar 26, 2026 · US
Selective porous glass for glass substrate singulation
US-2026090435-A1 · Mar 26, 2026 · US
Glass core substrate with edge bias
US-2026090427-A1 · Mar 26, 2026 · US
Integrated circuit packages including a glass-core substrate
US-2026082970-A1 · Mar 19, 2026 · US
Microelectronic assemblies including a glass-core with post-singulation edge features
US-2026082965-A1 · Mar 19, 2026 · US
Recent patents
Latest publications not already listed above.
Integrated circuit packages including a glass-core substrate
US-2026082969-A1 · Mar 19, 2026 · US
Glass cores with tapered insulator edges
US-2026076240-A1 · Mar 12, 2026 · US
Electronic substrates having embedded inductors
US-12573536-B2 · Mar 10, 2026 · US
Device, method, and system to provide passivation structures of a magnetic material based inductor
US-12555714-B2 · Feb 17, 2026 · US
Electronic packaging architecture with customized variable metal thickness on same buildup layer
US-12543578-B2 · Feb 3, 2026 · US
Micro led arrays on glass substrates for optical communications
US-2026011704-A1 · Jan 8, 2026 · US
High bandwidth optical interconnection architectures
US-12517314-B2 · Jan 6, 2026 · US
Tooling hole for hybrid panel assembly
US-2026005083-A1 · Jan 1, 2026 · US
Hybrid panel with a glass substrate
US-2026005160-A1 · Jan 1, 2026 · US
Hybrid panel with a glass substrate and plated frame
US-2026001297-A1 · Jan 1, 2026 · US
Inorganic reconstitution carrier panel
US-2026005020-A1 · Jan 1, 2026 · US
Glass core substrates with coupled inductor structures
US-2026005163-A1 · Jan 1, 2026 · US
Integrated circuit packages including substrates with reinforced glass cores
US-2025391718-A1 · Dec 25, 2025 · US
Integrated optical coupler
US-12498520-B2 · Dec 16, 2025 · US
Faraday rotator interconnect as a through-via configuration in a patch architecture
US-12481108-B2 · Nov 25, 2025 · US
Embedded faraday rotators and components for increasing bandwidth and/or reducing fiber count in photonics multi chip packages
US-2025317206-A1 · Oct 9, 2025 · US
Embedded component in glass core
US-2025309146-A1 · Oct 2, 2025 · US
Microelectronic structures including embedded etch stop in package core
US-2025309149-A1 · Oct 2, 2025 · US
Integrated circuit packages including a glass-core substrate with ultra-high aspect ratio through-glass vias
US-2025309015-A1 · Oct 2, 2025 · US
Integrated circuit packages including interposers having a glass layer and embedded dies
US-2025300088-A1 · Sep 25, 2025 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 223 |
| Intel Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/685 | 127 |
| H10W90/724 | 103 |
| H10W90/701 | 101 |
| H10W70/635 | 91 |
| H10W90/00 | 83 |