Glass etch protection and seware reduction by coating protection
US-2026090431-A1 · Mar 26, 2026 · US
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Chen Haobo patents
Chen Haobo is listed as an inventor on 110 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Chen Haobo |
| Total patents | 110 |
| First publication | Jul 4, 2019 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
3d printing of glass core edge protection in ic device packaging
US-2026090433-A1 · Mar 26, 2026 · US
Edge coating for glass core substrate with a frame
US-2026090430-A1 · Mar 26, 2026 · US
Edge coating for glass core substrate with air pressing for profile control
US-2026090429-A1 · Mar 26, 2026 · US
Methods and systems for forming integrated circuit packages comprising glass layers with thin singulated portions
US-2026090432-A1 · Mar 26, 2026 · US
Plasma-based glass package dicing
US-2026078046-A1 · Mar 19, 2026 · US
Integrated circuit packages including a glass-core substrate
US-2026082969-A1 · Mar 19, 2026 · US
Glass cores with tapered insulator edges
US-2026076240-A1 · Mar 12, 2026 · US
Patternable die attach materials and processes for patterning
US-12568831-B2 · Mar 3, 2026 · US
Hybrid panel with a glass substrate
US-2026005160-A1 · Jan 1, 2026 · US
Recent patents
Latest publications not already listed above.
Methods and systems for forming integrated circuit packages comprising glass layers
US-2026005115-A1 · Jan 1, 2026 · US
Hybrid panel with a glass substrate and plated frame
US-2026001297-A1 · Jan 1, 2026 · US
Integrated circuit packages including substrates with reinforced glass cores
US-2025391718-A1 · Dec 25, 2025 · US
Position controlled waveguides and methods of manufacturing the same
US-12449600-B2 · Oct 21, 2025 · US
Microelectronic assemblies including interconnects with different solder materials
US-12412868-B2 · Sep 9, 2025 · US
Methods and architectures for shallow fiducial and metal defined pad designs
US-2025273607-A1 · Aug 28, 2025 · US
Omni directional interconnect with magnetic fillers in mold matrix
US-12354883-B2 · Jul 8, 2025 · US
Technologies for power and spacer components embedded in a substrate core
US-2025218904-A1 · Jul 3, 2025 · US
Methods and apparatus to embed semiconductor devices in cores of package substrates
US-2025218960-A1 · Jul 3, 2025 · US
Vertically embedded components in package substrates
US-2025219021-A1 · Jul 3, 2025 · US
Microelectronic assemblies including cavity-less encapsulated dies
US-2025218926-A1 · Jul 3, 2025 · US
Flow enhanced dummy structure to enable capillary flow based sidewall filling
US-2025220818-A1 · Jul 3, 2025 · US
Passive component assembly for thickness modification to match core thickness
US-2025218999-A1 · Jul 3, 2025 · US
Methods and apparatus to embed a semiconductor device in a glass core
US-2025218957-A1 · Jul 3, 2025 · US
Deep trench capacitors in multi-core integrated circuit device package substrates
US-2025219028-A1 · Jul 3, 2025 · US
Low temperature solder interconnect for package pitch scaling
US-2025218998-A1 · Jul 3, 2025 · US
Microelectronic assemblies with pillar-first conductive via formation in glass cores
US-2025218880-A1 · Jul 3, 2025 · US
Microelectronic assemblies with strengthened glass cores
US-2025210426-A1 · Jun 26, 2025 · US
Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI)
US-12334447-B2 · Jun 17, 2025 · US
Embedded bridge with through silicon via bonding architectures
US-2025192059-A1 · Jun 12, 2025 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 109 |
| Intel Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/685 | 67 |
| H10W70/635 | 58 |
| H10W90/724 | 54 |
| H10W70/611 | 53 |
| H10W90/701 | 52 |