Glass etch protection and seware reduction by coating protection
US-2026090431-A1 · Mar 26, 2026 · US
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Shan Bohan patents
Shan Bohan is listed as an inventor on 120 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Shan Bohan |
| Total patents | 120 |
| First publication | Mar 30, 2017 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
3d printing of glass core edge protection in ic device packaging
US-2026090433-A1 · Mar 26, 2026 · US
Edge coating for glass core substrate with a frame
US-2026090430-A1 · Mar 26, 2026 · US
Edge coating for glass core substrate with air pressing for profile control
US-2026090429-A1 · Mar 26, 2026 · US
Singulation incorporating an etched metal channel
US-2026090424-A1 · Mar 26, 2026 · US
Socket assemblies for semiconductor devices
US-2026086114-A1 · Mar 26, 2026 · US
Methods and systems for forming integrated circuit packages comprising glass layers with thin singulated portions
US-2026090432-A1 · Mar 26, 2026 · US
Glass core substrate with edge bias
US-2026090427-A1 · Mar 26, 2026 · US
Microelectronic assemblies including a glass-core with post-singulation edge features
US-2026082965-A1 · Mar 19, 2026 · US
Plasma-based glass package dicing
US-2026078046-A1 · Mar 19, 2026 · US
Recent patents
Latest publications not already listed above.
Integrated circuit packages including a glass-core substrate
US-2026082969-A1 · Mar 19, 2026 · US
Glass cores with tapered insulator edges
US-2026076240-A1 · Mar 12, 2026 · US
Glass package with liquid metal socketing
US-2026040982-A1 · Feb 5, 2026 · US
Hybrid panel with a glass substrate
US-2026005160-A1 · Jan 1, 2026 · US
Methods and systems for forming integrated circuit packages comprising glass layers
US-2026005115-A1 · Jan 1, 2026 · US
Hybrid panel with a glass substrate and plated frame
US-2026001297-A1 · Jan 1, 2026 · US
Fabricating integrated circuit packages with glass core hybrid panels
US-2026005078-A1 · Jan 1, 2026 · US
Thin glass core panels in circuit device packaging
US-2026005079-A1 · Jan 1, 2026 · US
Frames for glass core hybrid panels
US-2026005114-A1 · Jan 1, 2026 · US
Microelectronic Glass-Containing Core Layer Including Clamp Structure
US-2026005084-A1 · Jan 1, 2026 · US
Integrated circuit packages including substrates with reinforced glass cores
US-2025391718-A1 · Dec 25, 2025 · US
Coaxial vias in glass core architectures
US-2025386432-A1 · Dec 18, 2025 · US
Microelectronic assemblies with double liners in through-glass vias
US-2025349729-A1 · Nov 13, 2025 · US
Integrated circuit packages including a glass-core substrate with ultra-high aspect ratio through-glass vias
US-2025309015-A1 · Oct 2, 2025 · US
Optical and electrical glass interposer with embedded bridge
US-2025300086-A1 · Sep 25, 2025 · US
Integrated circuit packages including interposers having a glass layer and embedded dies
US-2025300088-A1 · Sep 25, 2025 · US
Microelectronic assemblies including interconnects with different solder materials
US-12412868-B2 · Sep 9, 2025 · US
Methods and architectures for shallow fiducial and metal defined pad designs
US-2025273607-A1 · Aug 28, 2025 · US
Interconnections to package substrates for interconnect bridges
US-2025273582-A1 · Aug 28, 2025 · US
Multi-die bridge assemblies and methods for three-dimensional packaging
US-2025266395-A1 · Aug 21, 2025 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 116 |
| Univ Arizona State | 3 |
| Intel Corp | 1 |
| Arizona Board Of Regents On Behalf Of Ari | 1 |
| Mu Bin | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W70/635 | 65 |
| H10W70/685 | 61 |
| H10W90/00 | 56 |
| H10W70/611 | 56 |
| H10W90/724 | 53 |