Edge coating for glass core substrate with a frame
US-2026090430-A1 · Mar 26, 2026 · US
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Arrington Kyle patents
Arrington Kyle is listed as an inventor on 57 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Arrington Kyle |
| Total patents | 57 |
| First publication | Nov 5, 2020 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
3d printing of glass core edge protection in ic device packaging
US-2026090433-A1 · Mar 26, 2026 · US
Edge coating for glass core substrate with air pressing for profile control
US-2026090429-A1 · Mar 26, 2026 · US
Glass core substrate with edge bias
US-2026090427-A1 · Mar 26, 2026 · US
Flow enhanced dummy structure to enable capillary flow based sidewall filling
US-2025220818-A1 · Jul 3, 2025 · US
Passive component assembly for thickness modification to match core thickness
US-2025218999-A1 · Jul 3, 2025 · US
Reconstituted passive assemblies for embedding in thick cores
US-2025218906-A1 · Jul 3, 2025 · US
Deep trench capacitors in multi-core integrated circuit device package substrates
US-2025219028-A1 · Jul 3, 2025 · US
Low temperature solder interconnect for package pitch scaling
US-2025218998-A1 · Jul 3, 2025 · US
Low force liquid metal interconnect solutions
US-12349303-B2 · Jul 1, 2025 · US
Recent patents
Latest publications not already listed above.
Embedded bridge with through silicon via bonding architectures
US-2025192059-A1 · Jun 12, 2025 · US
Enhanced base die heat path using through-silicon vias
US-2025191998-A1 · Jun 12, 2025 · US
Direct bonding for embedded bridges with vias
US-2025183180-A1 · Jun 5, 2025 · US
Controlling substrate bump height
US-2025112164-A1 · Apr 3, 2025 · US
Apparatus and methods for capillary underfill of embedded devices
US-2025112085-A1 · Apr 3, 2025 · US
Glass core protection using peripheral buffer layers
US-2025112136-A1 · Apr 3, 2025 · US
Enhanced base die heat path using through-silicon vias
US-12266589-B2 · Apr 1, 2025 · US
Stiffener architectures for glass edge protection
US-2025106983-A1 · Mar 27, 2025 · US
Immersion cooling for integrated circuit devices
US-12238892-B2 · Feb 25, 2025 · US
2d fillers for reduced cte for pid
US-2024332125-A1 · Oct 3, 2024 · US
Methods, systems, apparatus, and articles of manufacture to improve reliability of vias in a glass substrate of an integrated circuit package
US-2024312865-A1 · Sep 19, 2024 · US
Copolymer compatibilizers and uses thereof
US-12091484-B2 · Sep 17, 2024 · US
Enhanced base die heat path using through-silicon vias
US-2024282667-A1 · Aug 22, 2024 · US
Capillary underfill formulations that include carbon nanotubes, containers, and methods
US-2024270929-A1 · Aug 15, 2024 · US
Light responsive photoresists and methods
US-2024264530-A1 · Aug 8, 2024 · US
Enhanced base die heat path using through-silicon vias
US-12057369-B2 · Aug 6, 2024 · US
Integrated heat spreader with enhanced vapor chamber for multichip packages
US-12046536-B2 · Jul 23, 2024 · US
Die attach in glass core package through organic-to-organic bonding
US-2024222345-A1 · Jul 4, 2024 · US
Methods and apparatus for optical thermal treatment in semiconductor packages
US-2024222301-A1 · Jul 4, 2024 · US
Methods and apparatus to reduce solder bump bridging between two substrates
US-2024222304-A1 · Jul 4, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 54 |
| Virginia Tech Intellectual Properties Inc | 2 |
| Intel Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/22 | 27 |
| H10W90/724 | 23 |
| H10W90/00 | 19 |
| H10W70/635 | 18 |
| H10W40/70 | 16 |