Rapid Thermal Processing System With Cooling System
US-2024379390-A1 · Nov 14, 2024 · US
US9202731B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9202731-B2 |
| Application number | US-201113334406-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 22, 2011 |
| Priority date | Dec 27, 2010 |
| Publication date | Dec 1, 2015 |
| Grant date | Dec 1, 2015 |
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Disclosed is a liquid processing apparatus that processes a substrate with a processing liquid. The processing apparatus includes: a substrate holder configured to hold the substrate; a processing liquid supply unit configured to supply the processing liquid to the substrate held by the substrate holder; a rinsing liquid supply unit configured to supply a rinsing liquid to the substrate; and a light emitting element configured to emit light of a wavelength range, which is absorbed only by the substrate, and irradiate the emitted light to the substrate.
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What is claimed is: 1. A liquid processing apparatus that processes a substrate with a processing liquid, the liquid processing apparatus comprising: a substrate holder configured to hold the substrate including a surface formed with a hole portion or a pattern; a processing liquid supply unit configured to supply the processing liquid to the substrate held by the substrate holder; a rinsing liquid supply unit configured to supply a rinsing liquid to the substrate; a light emitting element including a plurality of LEDs disposed on an upper side of the substrate holder and configured to emit light of a wavelength range corresponding to the substrate itself, absorbed directly only by the substrate itself including the surface formed with the hole portion or the pattern and irradiate the emitted light to the substrate, the plurality of LEDs being provided with a plurality of zones having a concentric shape; and a control unit configured to control an overall operation of the liquid processing apparatus including the substrate holder, the processing liquid supply unit, the rinsing liquid supply unit and the light emitting element, wherein the control unit is programmed to select a wavelength of the light emitting element in such a way that the light emitting element emits light of the wavelength range absorbed directly only by the substrate itself including the surface formed with the hole portion or the pattern in order to directly heat the substrate first and then indirectly heat the processing liquid within the hole portion or the pattern by the heated substrate, thereby increasing a diffusion coefficient of the heated processing liquid within the hole portion or the pattern in order to easily mix the heated processing liquid within the hole portion or the pattern and the rinsing liquid supplied on the surface of the substrate from the rinsing liquid supply unit, wherein the control unit is further programmed to control the plurality of LEDs of the light emitting element in the plurality of zones in order to set the temperature of a periphery area of the substrate to be higher than that of a center area of the substrate during a liquid processing using the processing liquid such that the temperature of the substrate becomes uniform at both the center area and the periphery area while the processing liquid flows toward the periphery area of the substrate, and wherein the control unit is also programmed to control the plurality of LEDs of the light emitting element in the plurality of zones in order to set the temperature of the periphery area of the substrate to be higher than that of the center area of the substrate during at lease a period of supplying the rinsing liquid to the substrate supplied with the processing liquid thereby generating a temperature gradient in a diameter direction of the substrate when the rinsing liquid is supplied to the substrate, which also creates convection between the processing liquid within the hole portion and the rinsing liquid supplied to the substrate. 2. The liquid processing apparatus of claim 1 , wherein the control unit is programmed to control the irradiation of the light from the light emitting element to begin only after supplying the rinsing liquid for a predetermined of time after stopping the irradiation of the light when supplying the rinsing liquid to the substrate. 3. The liquid processing apparatus of claim 1 , wherein the substrate is a silicon substrate, the light emitted by the light emitting element has a peak wavelength corresponding to the silicon substrate in the wavelength range of 400 nm to 1000 nm, and at least one of AlGaAs, GaN, GaInN, AlGaInP, and ZnO is used as the materials of the LEDs. 4. The liquid processing apparatus of claim 1 , further comprising: an organic solvent supply unit configured to supply an organic solvent to the substrate, wherein the control unit is programmed to control the organic solvent supply unit to supply the organic solvent to the substrate supplied with the rinsing liquid and control to dry the substrate after removing the rinsing liquid with the supplied organic solvent, and wherein the control unit is programmed to control the light emitted by the light emitting element to be irradiated to the substrate when supplying the organic solvent to the substrate. 5. The liquid processing apparatus of claim 1 , wherein the control unit is programmed to control the light emitted by the light emitting element to be irradiated to the substrate before supplying the processing liquid to the substrate. 6. The liquid processing apparatus of claim 1 , further comprising: a rotation driver configured to rotate the substrate holder, wherein the rotation driver is configured to rotate the substrate held by the substrate holder by rotating the substrate holder, and wherein the control unit is programmed to control the rotation driver such that rotational speed of the substrate holder when the processing liquid is supplied to the substrate is lower than the rotational speed of the substrate holder when the rinsing liquid is supplied to the substrate. 7. The liquid processing apparatus of claim 1 , wherein the plurality LEDs are provided on the upper side of the substrate holder at regular intervals. 8. The liquid processing apparatus of claim 1 further comprising a top plate installed on an upper side of the substrate holder and configured to cover the substrate held by the substrate holder from above, and the light emitting element is provided on a bottom surface of the top plate, wherein the top plate has an opening portion penetrating the top plate at the center thereof, and the opening portion is used to supply, to the substrate, the processing liquid and the rinsing liquid by the processing liquid supply unit and rinsing liquid supply unit, respectively, from above of the top plate. 9. The liquid processing apparatus of claim 8 , wherein the top plate is configured to be elevatable.
Cleaning during device manufacture · CPC title
using mainly spraying means, e.g. nozzles · CPC title
for cleaning followed by drying, rinsing, stripping, blasting or the like · CPC title
by wet cleaning only (H10P70/52 takes precedence) · CPC title
mainly by radiation · CPC title
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