Formaldehyde free electroless copper plating compositions and methods

US9611550B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9611550-B2
Application numberUS-201313769332-A
CountryUS
Kind codeB2
Filing dateFeb 17, 2013
Priority dateDec 26, 2012
Publication dateApr 4, 2017
Grant dateApr 4, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.

First claim

Opening claim text (preview).

What is claimed is: 1. An aqueous based composition consisting of one or more sources of copper ions, one or more chelating agents selected from the group consisting of polycarboxylic acids, salts thereof, polyaminocarboxylic acids and salts thereof, water, optionally one or more stabilizers selected from the group consisting of amines, alkanolamines, thioamides, azole compounds and salts thereof, optionally one or more surfactants, and one or more reducing agents having formula: wherein X y+ is a neutralizing counter cation of formula (I), where y+ is an integer of one or greater and X y+ is selected from the group consisting of H + , ammonium cation, quaternary ammonium cation, sulfonium cation, phosphonium cation, pyridinium cation, monovalent metal cation, multivalent metal cation and divalent organometallic cation; R and R′ are independently hydrogen, carboxyl, carboxyalkyl, sulfonate, sulfoxide, unsubstituted, linear or branched alkyl, sulfinate; substituted or unsubstituted aryl; Z is chosen from unsubstituted, linear or branched (C 1 -C 6 ) alkyl, acetyl or substituted or unsubstituted (C 6 -C 10 ) aryl; m is an integer of 1 to 6; and n is 1; and the composition is free of formaldehyde. 2. The aqueous based composition of claim 1 , wherein the one or more reducing agents range from 0.1 g/L to 100 g/L. 3. The aqueous based composition of claim 1 , wherein the one or more chelating agents range from 50 g/L to 150 g/L. 4. The aqueous based composition of claim 1 , wherein the one or more stabilizers range from 0.1 ppm to 1000 ppm.

Assignees

Inventors

Classifications

  • mainly consisting of metals or alloys · CPC title

  • C23C18/40Primary

    using reducing agents · CPC title

  • means therefor, e.g. baths, apparatus · CPC title

  • Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances · CPC title

  • Coating with copper · CPC title

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Frequently asked questions

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What does patent US9611550B2 cover?
The copper electroless baths are formaldehyde free and are environmentally friendly. The electroless copper baths include one or more sulfinate compounds as reducing agents to replace formaldehyde. The electroless baths are stable and deposit a bright copper on substrates.
Who is the assignee on this patent?
Rohm & Haas Elect Mat
What technology area does this patent fall under?
Primary CPC classification C23C18/40. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Apr 04 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).