Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor device
US-11749510-B2 · Sep 5, 2023 · US
US12442083B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12442083-B2 |
| Application number | US-202017782168-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 24, 2020 |
| Priority date | Dec 4, 2019 |
| Publication date | Oct 14, 2025 |
| Grant date | Oct 14, 2025 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The present disclosure provides an electrode support, a supporting mechanism, a support, a film coating apparatus, and an application. The electrode support is applied to the film coating apparatus. The film coating apparatus allows coating of at least one to-be-coated workpiece. The film coating apparatus comprises a reaction chamber and a pulse power supply; the pulse power supply is used for providing a pulse electric field in the reaction chamber. The electrode support comprises support members arranged in multiple layers; the support member of each layer is separately retained at a preset spacing; at least one layer of the support member is conductively connected to the pulse power supply to serve as a negative electrode of the pulse power supply. The electrode support can uniformly load the to-be-coated workpiece and can be used as an electrode, and wiring between the electrode support and an external power supply is simple.
Opening claim text (preview).
The invention claimed is: 1. An electrode support, configured for a film coating apparatus for forming coating on at least one to-be-coated workpiece, wherein the film coating apparatus comprises a reaction chamber body and a pulse power supply, and the pulse power supply is configured to provide a pulse electric field in the reaction chamber body; and wherein the electrode support comprises a plurality of support members disposed in multiple layers and spaced apart by a preset spacing, and at least one layer of support member of the plurality of support members disposed in multiple layers_is conductively coupled with the pulse power supply as a cathode of the pulse power supply; wherein at least one layer of support member of the plurality of support members disposed in multiple layers comprises a support top plate and a support bottom plate, there is a space between the support top plate and the support bottom plate, and the support bottom plate has at least one gas distribution opening, wherein the film coating apparatus comprises a gas supply part, and at least one support member forms at least part of the gas supply part, wherein the gas supply part is disposed on the plurality of support members as an anode of the pulse power supply, and the at least one gas distribution opening is evenly disposed on the plurality of support members as the anode of the pulse power supply towards a next layer of the support member of the plurality of support members disposed in multiple layers; or at least one layer of support member of the plurality of support members disposed in multiple layers comprises a first partial support member and a second partial support member, the first partial support member is disposed above the second partial support member and disposed on the second partial support member, and the first partial support member is conductively coupled with the pulse power supply as the cathode, wherein the second partial support member is used as the gas supply part for gas distribution. 2. The electrode support according to claim 1 , wherein at least one layer of support member of the plurality of support members disposed in multiple layers_is conductively coupled with the pulse power supply as an anode of the pulse power supply. 3. The electrode support according to claim 2 , wherein the support member as the cathode of the pulse power supply is disposed below the support member as the anode of the pulse power supply, and the to-be-coated workpiece is disposed on the support member as the cathode of the pulse power supply. 4. The electrode support according to claim 2 , wherein the support member as the cathode of the pulse power supply and the support member as the anode of the pulse power supply are disposed alternately. 5. The electrode support according to claim 1 , wherein another layer of support member of the plurality of support members disposed in multiple layers disposed below the support member as the gas supply part is conductively coupled with the pulse power supply as the cathode of the pulse power supply. 6. The electrode support according to claim 1 , wherein the support member as the gas supply part is conductively coupled with a radio frequency power supply of the film coating apparatus. 7. The electrode support according to claim 1 , wherein the second partial support member has at least one gas transmission path and at least one gas distribution opening, the gas distribution opening is communicated with the gas transmission path, and the gas distribution opening is disposed towards the first partial support member of a next layer of the support member of the plurality of support members disposed in multiple layers. 8. The electrode support according to claim 7 , wherein the second partial support member is insulated from the first partial support member. 9. The electrode support according to claim 1 , further comprising at least one post, wherein each of the plurality of support members are supported on the post at intervals. 10. The electrode support according to claim 9 , wherein at least one support member is conductively coupled with the post and is conductively coupled with the pulse power supply outside the reaction chamber body through the post. 11. The electrode support according to claim 9 , wherein distances between two adjacent support members of the plurality of support members disposed in multiple layers supported on the post are the same. 12. The electrode support according to claim 9 , further comprising at least one insulating member, wherein the at least one insulating member is disposed at a bottom end of the post to insulate the electrode support from the reaction chamber body. 13. The electrode support according to claim 9 , wherein the support members of the plurality of support members disposed in multiple layers and the post are made of stainless steel. 14. The electrode support according to claim 1 , wherein distances between two adjacent support members of the plurality of support members disposed in multiple layers range from 10 mm to 200 mm.
the substrate being supported substantially horizontally · CPC title
using plasma jets · CPC title
using pulsed discharges · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.