Sensors and system for in-situ edge ring erosion monitor

Patent metadata

Field	Value
Publication number	US-12009236-B2
Application number	US-201916391262-A
Country	US
Kind code	B2
Filing date	Apr 22, 2019
Priority date	Apr 22, 2019
Publication date	Jun 11, 2024
Grant date	Jun 11, 2024

Abstract

The present disclosure generally relates to a method and apparatus for determining a metric related to erosion of a ring assembly used in an etching within a plasma processing chamber. In one example, the apparatus is configured to obtain a metric indicative of erosion on an edge ring disposed on a substrate support assembly in a plasma processing chamber. A sensor obtains the metric for the edge ring. The metric correlates to the quantity of erosion in the edge ring. In another example, the ring sensor may be arranged outside of a periphery of a substrate support assembly. The metric may be acquired by the ring sensor through a plasma screen.

First claim

What we claim is:

1. A plasma processing chamber comprising:
a chamber body having a plurality of walls defining an internal volume;
a substrate support assembly disposed within the internal volume, wherein the substrate support assembly comprises:
an outer periphery; and
a substrate support extending to the outer periphery and having a top surface;

an edge ring having an upper surface and a lower surface opposite the upper surface, the lower surface of the edge ring disposed on the top surface of the substrate support proximate the outer periphery;
a sleeve configured to at least partially support the edge ring, the sleeve cylindrical in shape and circumscribing the substrate support, the sleeve having an opening formed along an upper surface of the sleeve, wherein the edge ring further comprises an attachment member aligned with the opening in the sleeve; and
a first sensor fixedly disposed within the opening of the sleeve adjacent to and below the upper surface of the sleeve, the sleeve disposed below the top surface and outside the outer periphery of the substrate support assembly, the first sensor configured to detect a metric of erosion of the edge ring, wherein the first sensor is a displacement sensor, and the displacement sensor includes a flexible membrane attached to sidewalls of the opening and arranged such that the attachment member contacts and displaces the flexible membrane.

2. The plasma processing chamber of claim 1 , wherein the metric is indicative of erosion of the upper surface of the edge ring.

3. The plasma processing chamber of claim 2 further comprising:
a plasma screen coupled to the outer periphery of the substrate support assembly, the plasma screen having an upper screen surface and a plurality of orifices extending therethrough.

4. The plasma processing chamber of claim 2 , further comprising:
a second sensor; and
a third sensor, wherein the first sensor, second sensor, and third sensor are each configured to detect erosion in the edge ring.

5. The plasma processing chamber of claim 4 , wherein the first sensor, second sensor, and third sensor are equidistantly spaced with respect to the edge ring.

6. The plasma processing chamber of claim 1 , wherein the sleeve is configured to move the edge ring between a lowered and a raised position.

7. The plasma processing chamber of claim 1 , wherein the opening formed into the upper surface of the sleeve has the first sensor and the first sensor is exposed to the edge ring.

Assignees

• Applied Materials Inc

Inventors

• Pan Yaoling
• Tae Patrick John
• Willwerth Michael D
• Tedeschi Leonard M
• Byun Daniel Sang
• Kraus Philip Allan
• Criminale Phillip A
• Lee Changhun
• Dhindsa Rajinder
• Schmid Andreas
• Koosau Denis M

Classifications

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/0606 Primary

  Position monitoring, e.g. misposition detection or presence detection · CPC title

• H01J37/3288 Primary

  Maintenance · CPC title

• H03K17/955

  using a capacitive detector · CPC title

• H01J2237/022

  Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube · CPC title