Semiconductor component having a diode structure in a SiC semiconductor body

Patent metadata

Field	Value
Publication number	US-11742391-B2
Application number	US-202117163955-A
Country	US
Kind code	B2
Filing date	Feb 1, 2021
Priority date	Feb 22, 2018
Publication date	Aug 29, 2023
Grant date	Aug 29, 2023

Abstract

A semiconductor component includes a semiconductor component, including: a merged PiN Schottky (MPS) diode structure in a SiC semiconductor body having a drift zone of a first conductivity type; an injection region of a second conductivity type adjoining a first surface of the SiC semiconductor body; a contact structure at the first surface, the contact structure forming a Schottky contact with the drift zone and electrically contacting the injection region; and a zone of the first conductivity type formed between the injection region and a second surface of the SiC semiconductor body, the second surface being situated opposite the first surface. The zone is at a maximal distance of 1 μm from the injection region of the second conductivity type.

First claim

What is claimed is:

1. A semiconductor component, comprising:
a pn diode structure in a SiC semiconductor body having a drift zone of a first conductivity type;
an injection region of a second conductivity type adjoining a first surface of the SiC semiconductor body;
a contact structure at the first surface, the contact structure electrically contacting the injection region; and
a zone of the first conductivity type formed between the injection region and a second surface of the SiC semiconductor body, the second surface being situated opposite the first surface,
wherein the zone is electrically isolated from the contact structure at the first surface and is at a maximal distance of 1 μm from the injection region of the second conductivity type.

2. The semiconductor component of claim 1 , wherein the zone is doped more highly than the drift zone, and wherein a maximum dopant concentration in the zone is greater than a minimum dopant concentration in the drift zone by at least a factor of 2.

3. The semiconductor component of claim 1 , wherein a vertical extent of the zone lies in a range of from 50 nm to 1000 nm.

4. The semiconductor component of claim 1 , wherein a dopant dose of the zone lies in a range of 5% to 20% of a breakdown charge of SiC.

5. The semiconductor component of claim 1 , wherein the zone at the location of the maximum dopant concentration is partly compensated with dopants of the second conductivity type.

6. The semiconductor component of claim 1 , wherein the zone is at least partly doped with a dopant having a deep energy level with a gap of at least 150 meV with respect to the closest band edge.

7. The semiconductor component of claim 6 , wherein the dopant comprises at least one of phosphorus, chromium and iridium.

8. The semiconductor component of claim 1 , further comprising:
a recombination zone having recombination centres composed of lattice defects and/or heavy metal atoms,
wherein the recombination zone is formed between the zone and a second surface situated opposite the first surface.

9. The semiconductor component of claim 8 , further comprising:
a further recombination zone having recombination centres composed of lattice defects and/or heavy metal atoms,
wherein the further recombination zone is formed between the first surface and the recombination zone and is spaced apart from the recombination zone.

Assignees

• Infineon Technologies Ag

Inventors

• Basler Thomas
• Schulze Hans-Joachim
• Siemieniec Ralf

Classifications

• H10D62/129

  Cathode regions of diodes · CPC title

• H10D64/256

  for lateral devices wherein the source or drain electrodes are recessed in semiconductor bodies (source or drain electrodes of TFTs H10D30/673) · CPC title

• H10D84/144

  in antiparallel diode configurations · CPC title

• H10D62/834

  further characterised by the dopants · CPC title

• H10D62/157

  Impurity concentrations or distributions · CPC title