Electronic device and method of manufacturing an electronic device

Patent metadata

Field	Value
Publication number	US-11670570-B2
Application number	US-202016870068-A
Country	US
Kind code	B2
Filing date	May 8, 2020
Priority date	May 22, 2019
Publication date	Jun 6, 2023
Grant date	Jun 6, 2023

Abstract

An electronic device includes a substrate, at least one electronic element on the substrate, a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein, and a bracket covering the substrate, the at least one electronic element and the heat dissipating pad.

First claim

What is claimed is:

1. An electronic device comprising:
a substrate;
at least one electronic element on the substrate;
a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including an encapsulated phase change material therein; and
a bracket covering the substrate, the at least one electronic element and the heat dissipating pad, the bracket directly contacting the substrate and the heat dissipating pad.

2. The electronic device of claim 1 , wherein the heat dissipating pad comprises
a thermal conductive material layer covering the at least one electronic element; and
a plurality of phase change particles in the thermal conductive material layer, the phase change particles including the phase change material.

3. The electronic device of claim 2 , wherein the thermal conductive material layer includes a silicon material or a thermosetting material.

4. The electronic device of claim 2 , wherein each of the phase change particles is surrounded by a capsule including a thermal conductive material.

5. The electronic device of claim 2 , wherein the thermal conductive material layer has a 3D printed geometric structure, and the geometric structure has a cavity.

6. The electronic device of claim 2 , wherein the heat dissipating pad further includes a thermal interface material layer on a surface of the thermal conductive material layer in thermal contact with the electronic element.

7. The electronic device of claim 1 , wherein the bracket includes the encapsulated phase change material therein.

8. The electronic device of claim 1 , wherein the heat dissipating pad and the bracket are spaced apart from each other to form at least one space.

9. The electronic device of claim 1 , further comprising:
a casing surrounding the bracket.

10. The electronic device of claim 1 , further comprising an underfill member between the substrate and the at least one electronic element, and
wherein at least one of the substrate and the underfill member includes the encapsulated phase change material.

11. An electronic device comprising:
a substrate;
at least one electronic element on the substrate;
a heat dissipating pad on the substrate in thermal contact with the at least one electronic element, and including a thermal conductive material layer covering the at least one electronic element and a plurality of phase change particles in the thermal conductive material layer; and
a bracket covering the substrate, the at least one electronic element and the heat dissipating pad, the bracket directly contacting the substrate and the heat dissipating pad.

12. The electronic device of claim 11 , wherein the plurality of phase change particles each have a phase change temperature range of between about 10° C. and about 100° C.

13. The electronic device of claim 11 , wherein each of the phase change particles is surrounded by a capsule including a thermal conductive material.

14. The electronic device of claim 11 , wherein the conductive material layer includes a porous material having a cavity.

15. The electronic device of claim 11 , wherein the heat dissipating pad and the bracket are spaced apart from each other to form at least one space.

16. A portable solid state drive, comprising:
a substrate;
a plurality of non-volatile memory devices on the substrate;
a heat dissipating pad on the substrate in thermal contact with the non-volatile memory devices, and including a thermal conductive material layer and a plurality of phase change particles in the thermal conductive material layer;
a bracket covering the substrate, a plurality of the non-volatile memory devices and the heat dissipating pad, the bracket directly contacting the substrate and the heat dissipating pad; and
a casing surrounding the bracket.

17. The portable solid state drive of claim 16 , wherein the phase change particles are each surrounded by a capsule including a thermal conductive material.

18. The portable solid state drive of claim 16 , wherein the bracket includes an encapsulated phase change material therein.

19. The portable solid state drive of claim 16 , further comprising:
a coating layer directly on a surface of the casing, the coating layer including an encapsulated phase change material.

20. The portable solid state drive of claim 16 , further comprising an underfill member between the substrate and the non-volatile memory devices, and
wherein at least one of the substrate and the underfill member includes an encapsulated phase change material.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Cinar Yusuf
• Park Jaehong
• Baek Seongyun
• Lee Hanhong

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/071

  Connecting or disconnecting · CPC title

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title