Method for mounting an electrical component, wherein a hood is used, and hood suitable for use in said method

Patent metadata

Field	Value
Publication number	US-10008394-B2
Application number	US-201515301787-A
Country	US
Kind code	B2
Filing date	Mar 30, 2015
Priority date	Apr 4, 2014
Publication date	Jun 26, 2018
Grant date	Jun 26, 2018

Abstract

A method for mounting an electrical component to a substrate may include mounting the component onto the substrate, forming a cover including a thermally softenable or hardenable material and a contacting structure defined by integrated conductor paths, mounting the cover onto a mounting side of the substrate and onto the component mounted on the substrate, such that (a) the cover laterally traverses the component, (b) first contact surfaces of the contacting structure engage with the substrate at a first joining level defined at the mounting side of the substrate, and (c) second contact surfaces of the contacting structure engage with the component at a second joining level at the top side of the component, the second joining level being different than the first joining level. After assembling the components, joining connections at the first and second joining levels may be completed by a temperature or pressure based joining process.

First claim

What is claimed is:

1. A method for mounting an electrical component on a substrate, wherein the component has a bottom side facing toward the substrate and a top side situated opposite said bottom side, the method comprising:
mounting the electrical component onto the substrate,
forming a cover including integrated conductor paths that define a contacting structure,
wherein the cover comprises a composite material having fibers and a matrix, the matrix comprising a thermosetting resin not yet fully hardened,
mounting the cover onto a mounting side of the substrate and onto the top side of electrical component mounted on the substrate while the cover is not yet fully hardened, such that:
the cover traverses the electrical component in a lateral direction,
first contact surfaces of the contacting structure laterally outside the electrical component engage with the substrate at a first joining level defined at the mounting side of the substrate, and
second contact surfaces of the contacting structure engage with the electrical component at a second joining level defined at the top side of the electrical component, the second joining level being different than the first joining level, and
heating the material of the cover into a temperature range sufficient to fully harden the thermosetting resin after the cover has been mounted to the substrate and the electrical component,
wherein the top side of the electrical component is connected to the mounting side of the substrate via the contacting structure.

2. The method of claim 1 , comprising, after mounting the electrical component to the substrate and mounting the cover onto the substrate and the electrical component, performing a temperature or pressure based joining process to complete joining connections between the cover and the electrical component at the first joining level and between the cover and the substrate at the second joining level.

3. The method of claim 2 , wherein hardening the thermosetting resin of the cover and the completion of the joining connections are performed in one and the same process under the same conditions.

4. The method of claim 2 , comprising mounting a rear side of the substrate, opposite the mounting side, to a component part at a third joining level, and
completing a joining connection between the substrate and the component part at the third joining level, simultaneous with the completion of the joining connections at the first and second joining levels, via the temperature or pressure based joining process.

5. The method of claim 1 , wherein the cover has a planar outer surface that runs parallel to the substrate.

6. The method of claim 1 , wherein the cover comprises a phase change material with a phase change temperature above an operating temperature of the component.

7. The method of claim 6 , wherein the phase change material is enclosed in an encapsulation.

8. A cover for an electrical assembly that includes a substrate and at least one component mounted on the substrate, the cover comprising:
a support surface on an inner side of the cover and configured to engage the substrate upon mounting the cover onto the substrate,
a cavity configured to receive the component upon mounting the cover onto the substrate,
conductor paths defining a contacting structure integrated in the cover,
wherein the cover comprises a composite material having fibers and matrix, the matrix comprising a thermosetting resin not fully hardened until the cover is mounted onto the substrate, and
wherein the support surface includes surface portions of the contacting structure that define contact surfaces that engage the substrate and the component upon mounting of the cover onto the substrate.

9. The cover of claim 8 , wherein the cover has a sandwich type of construction, wherein both the composite material of the cover and the contacting structure form layers of the sandwich.

10. The cover of claim 8 , comprising an additional material applied, in the cover, to the contact surfaces of the contact structure.

11. The cover of claim 8 , wherein the support surface is formed by an edge of the cover.

12. The cover of claim 8 , wherein an outer surface of the cover is planar.

Assignees

• Siemens Ag

Inventors

• Busche Nora
• Strogies Joerg
• Wilke Klaus

Classifications

• H10W90/764

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/401

  characterised by multiple insulating or insulated package substrates, interposers or RDLs · CPC title

• H10W76/67

  characterised by their materials · CPC title