Multi-layer heat dissipating device comprising heat storage capabilities, for an electronic device

Patent metadata

Field	Value
Publication number	US-9918407-B2
Application number	US-201615226727-A
Country	US
Kind code	B2
Filing date	Aug 2, 2016
Priority date	Aug 2, 2016
Publication date	Mar 13, 2018
Grant date	Mar 13, 2018

Abstract

A heat dissipating device that includes a first heat spreader layer, a second heat spreader layer, a first spacer, a second spacer, a first phase change material (PCM), and a second phase change material (PCM). The first heat spreader layer includes a first spreader surface and a second spreader surface. The second heat spreader layer includes a third spreader surface and a fourth spreader surface. The first spacer is coupled to the first heat spreader layer and the second heat spreader layer. The second spacer is coupled to the first heat spreader layer and the second heat spreader layer. The first PCM is located between the first heat spreader layer and the second heat spreader layer. The first PCM is surrounded by the first spacer. The second PCM is between the first heat spreader layer, the second heat spreader layer, the first spacer and the second spacer.

First claim

What is claimed is:

1. A multi-layer heat dissipating device comprising:
a first heat spreader layer configured to be coupled to a region configured to generate heat;
a second heat spreader layer;
a first spacer coupled to the first heat spreader layer and the second heat spreader layer;
a first phase change material (PCM) located between the first heat spreader layer, the second heat spreader layer, and the first spacer, wherein the first PCM comprises a first melting temperature;
a second spacer coupled to the first heat spreader layer and the second heat spreader layer; and
a second phase change material (PCM) located between the first heat spreader layer, the second heat spreader layer, the first spacer and the second spacer, wherein the second PCM comprises a second melting temperature,
wherein the first phase change material (PCM) is closer to the region configured to generate heat than the second phase change material (PCM),
wherein the first phase change material (PCM) has a higher melting temperature than the second phase change material (PCM).

2. The multi-layer heat dissipating device of claim 1 , further comprising:
a third heat spreader layer;
a third spacer coupled to the second heat spreader layer and the third heat spreader layer; and
a third phase change material (PCM) located between the second heat spreader layer and the third heat spreader layer, wherein the third PCM is surrounded by the third spacer.

3. The multi-layer heat dissipating device of claim 2 , further comprising:
a fourth spacer coupled to the second heat spreader layer and the third heat spreader layer; and
a fourth phase change material (PCM) located between the second heat spreader layer, the third heat spreader layer, the third spacer and the fourth spacer.

4. The multi-layer heat dissipating device of claim 3 , wherein the third PCM comprises a third melting temperature, and the fourth PCM comprises a fourth melting temperature, and wherein the first melting temperature of the first PCM is greater than the second melting temperature, the third melting temperature and the fourth temperature.

5. The multi-layer heat dissipating device of claim 1 , wherein the first spacer comprises a thermally conductive adhesive layer and/or a thermally insulative layer.

6. The multi-layer heat dissipating device of claim 1 , wherein the first heat spreader layer is coupled to a heat generating component through a thermal interface material.

7. The multi-layer heat dissipating device of claim 1 , wherein the multi-layer heat dissipating device is incorporated into a device selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of things (IoT) device, a laptop computer, a server, and a device in an automotive vehicle.

8. An apparatus comprising:
a first means for spreading heat configured to be coupled to a region configured to generate heat;
a second means for spreading heat;
a first spacer coupled to the first means for spreading heat and the second means for spreading heat;
a first means for storing heat located between the first means for spreading heat, the second means for spreading heat, and the first spacer, wherein the first means for storing heat comprises a first melting temperature;
a second spacer coupled to the first means for spreading heat and the second means for spreading heat; and
a second means for storing heat located between the first means for spreading heat, the second means for spreading heat, the first spacer and the second spacer, wherein the second means for storing heat comprises a second melting temperature,
wherein the first means for storing heat is closer to the region configured to generate heat than the second means for storing heat,
wherein the first means for storing heat has a higher melting temperature than the second means for storing heat.

9. The apparatus of claim 8 , further comprising:
a third means for spreading heat;
a third spacer coupled to the second means for spreading heat and the third means for spreading heat; and
a third means for storing heat located between the second means for spreading heat and the third means for spreading heat, wherein the third means for storing heat is surrounded by the third spacer.

10. The apparatus of claim 9 , further comprising:
a fourth spacer coupled to the second means for spreading heat and the third means for spreading heat; and
a fourth means for storing heat located between the second means for spreading heat, the third means for spreading heat, the third spacer and the fourth spacer.

11. The apparatus of claim 10 , wherein the third means for storing heat comprises a third melting temperature, and the fourth means for storing heat comprises a fourth melting temperature, and wherein the first melting temperature of the first means for storing heat is greater than the second melting temperature, the third melting temperature and the fourth temperature.

12. The apparatus of claim 8 , wherein the first spacer comprises a thermally conductive adhesive layer and/or a thermally insulative layer.

13. The apparatus of claim 8 , wherein the first means for spreading heat is coupled to a heat generating component through a thermal interface material.

14. The apparatus of claim 8 , wherein the apparatus is incorporated into a device selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of things (IoT) device, a laptop computer, a server, and a device in an automotive vehicle.

15. A device comprising:
a region configured to generate heat, the region comprising an integrated device;
a first heat spreader layer coupled to the region;
a second heat spreader layer;
a first spacer coupled to the first heat spreader layer and the second heat spreader layer;
a first phase change material (PCM) located between the first heat spreader layer, the second heat spreader layer, and the first spacer, wherein the first PCM comprises a first melting temperature;
a second spacer coupled to the first heat spreader layer and the second heat spreader layer; and
a second phase change material (PCM) located between the first heat spreader layer, the second heat spreader layer, the first spacer and the second spacer, wherein the second PCM comprises a second melting temperature,
wherein the first phase change material (PCM) is closer to the region configured to generate heat than the second phase change material (PCM),
wherein the first phase change material (PCM) has a higher melting temperature than the second phase change material (PCM).

16. The device of claim 15 , further comprising:
a third heat spreader layer;
a third spacer coupled to the second heat spreader layer and the third heat spreader layer; and
a third phase change material (PCM) located between the second heat spreader layer and the third heat spreader layer, wherein the third PCM is surrounded by the third spacer.

17. The device of claim 16 , further comprising:
a fourth spacer coupled to the second heat spreader layer and the third heat spreader layer; and
a fourth phase change material (PCM) located between the second heat spreader laye

Assignees

• Qualcomm Inc

Inventors

• Rosales Jorge
• Chiriac Victor

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/735

  by melting or evaporation of solids · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H05K7/20509 Primary

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title