Printed circuit boards and methods of manufacturing thereof

Patent metadata

Field	Value
Publication number	US-9648735-B2
Application number	US-201514729158-A
Country	US
Kind code	B2
Filing date	Jun 3, 2015
Priority date	Jun 5, 2014
Publication date	May 9, 2017
Grant date	May 9, 2017

Abstract

A printed circuit board includes an electrically conductive layer and a dielectric layer including a polymer, wherein the polymer includes metallic particles.

First claim

The invention claimed is:

1. A printed circuit board, comprising:
an electrically conductive layer; and
a dielectric layer comprising a polymer, wherein the polymer comprises metallic particles,
wherein the metallic particles are localized at a main surface of the printed circuit board.

2. The printed circuit board of claim 1 , wherein the polymer comprises at least one of a thermoplastic polymer, a thermoset polymer, and a mixture thereof.

3. The printed circuit board of claim 1 , wherein the polymer comprises at least one of an epoxy, an acrylate, an imide, a silicone resin, and a mixture thereof.

4. The printed circuit board of claim 1 , wherein a volumetric fill factor of the metallic particles in the polymer has a value between 20% and 90%.

5. The printed circuit board of claim 1 , wherein a volumetric fill factor of the metallic particles in the polymer is chosen to provide a thermal conductivity of the polymer of at least 10 W/(m*K).

6. The printed circuit board of claim 1 , wherein the polymer comprises an amorphous polymer with a glass transition temperature of equal or greater than 260° C., or wherein the polymer comprises a crystalline or semi-crystalline polymer with a melting temperature of equal or greater than 260° C.

7. The printed circuit board of claim 1 , wherein the polymer comprises at least one of: polyether ether ketone, polyamide-imide, polyethersulfone, polysulfone, polytetrafluoroethylene, polyphenylene sulfide, and liquid-crystal polymer.

8. The printed circuit board of claim 1 , wherein the metallic particles are coated with an electrically insulating material.

9. The printed circuit board of claim 8 , wherein the metallic particles comprise a metal and the electrically insulating material comprises an oxide of the metal.

10. The printed circuit board of claim 1 , wherein the electrically conductive layer comprises at least one of: a via connection extending through the dielectric layer, and an electrically conductive layer arranged on a surface of the dielectric layer, and wherein the metallic particles comprise a metal and at least one side wall of the via connection and the electrically conductive layer comprises the metal.

11. The printed circuit board of claim 1 , wherein the polymer comprises a thermoplastic polymer.

12. A printed circuit board, comprising:
an electrically conductive layer;
a dielectric layer comprising a polymer, wherein the polymer comprises metallic particles; and
a further dielectric layer comprising a polymer, wherein the polymer of the further dielectric layer comprises metallic particles, wherein a thermal conductivity of the further dielectric layer differs from a thermal conductivity of the dielectric layer.

Assignees

• Infineon Technologies Ag

Inventors

• Mahler Joachim
• Otremba Ralf

Classifications

• H05K3/0094

  Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement · CPC title

• H05K2201/0281

  Conductive fibers · CPC title

• H05K3/007

  Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence) · CPC title

• H05K2201/0215

  Metallic fillers · CPC title

• H05K2201/0129

  Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer · CPC title