Electronic device with phase change material microcapsule layer
US-9282679-B2 · Mar 8, 2016 · US
Method for forming a case for an electronic device and manufactured case structure for electronic device
US9799585B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9799585-B2 |
| Application number | US-201414249084-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 9, 2014 |
| Priority date | Jun 17, 2013 |
| Publication date | Oct 24, 2017 |
| Grant date | Oct 24, 2017 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A method for forming a case for an electronic device and a manufactured case structure for an electronic device are provided. The method for forming a case for an electronic device comprises the following steps. Provide a plastic material. Provide a plurality of PCM microcapsules. Mix the plastic material and the plurality of PCM microcapsules so as to form a housing material. Form a case from the housing material by injection molding. The manufactured case structure for an electronic device comprises a plastic layer and a plurality of PCM microcapsules. The plurality of PCM microcapsules are dispersed in the plastic layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A method for forming a case for an electronic device, comprising: providing a plastic material; providing a plurality of phase change material (PCM) microcapsules; mixing the plastic material and the plurality of PCM microcapsules so as to form a housing material; and forming a case for an electronic device from the housing material by injection molding, wherein each of the plurality of PCM microcapsules comprises a capsule shell and a capsule core, the capsule core is enclosed by the capsule shell, the material of the capsule shell is a polymer, the material of the capsule core comprises a phase change material, and a melting point of the phase change material is between 20° C. and 75° C., and wherein the melting point of the capsule shell of the plurality of PCM microcapsules is higher than the melting point of the plastic material. 2. The method for forming a case for an electronic device according to claim 1 , wherein the housing material forms the case for an electronic device by injection molding under a reaction temperature, the reaction temperature is lower than the melting point of the capsule shell of the plurality of PCM microcapsules, the reaction temperature is higher than the melting point of the plastic material. 3. The method for forming a case for an electronic device according to claim 1 , wherein in the steps of mixing the plastic material and the plurality of PCM microcapsules so as to form the housing material, the volume ratio of the plastic material to the plurality of PCM microcapsules is between 4:1 and 99:1. 4. A case structure for an electronic device, comprising: a plastic layer; and a plurality of PCM microcapsules, dispersing in the plastic layer, wherein each of the plurality of PCM microcapsules comprises a capsule shell and a capsule core, the capsule core is enclosed by the capsule shell, the material of the capsule shell is a polymer, the material of the capsule core comprises a phase change material, and a melting point of the phase change material is between 20° C. and 75° C., and wherein the melting point of the capsule shell of the plurality of PCM microcapsules is higher than the melting point of the plastic layer. 5. The case structure for an electronic device according to claim 4 , wherein the material of the capsule shell of the plurality of PCM microcapsules comprises a polycarbonate and a glass fiber. 6. The case structure for an electronic device according to claim 4 , wherein the volume ratio of the plastic layer to the plurality of PCM microcapsules is between 4:1 and 99:1.
Assignees
Inventors
Classifications
- H10W40/735Primary
by melting or evaporation of solids · CPC title
- B29C45/0001Primary
characterised by the choice of material · CPC title
characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title
- H01L23/4275Primary
Electricity · mapped topic
Cross-Sectional Technologies · mapped topic
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Frequently asked questions
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- What does patent US9799585B2 cover?
- A method for forming a case for an electronic device and a manufactured case structure for an electronic device are provided. The method for forming a case for an electronic device comprises the following steps. Provide a plastic material. Provide a plurality of PCM microcapsules. Mix the plastic material and the plurality of PCM microcapsules so as to form a housing material. Form a case from …
- Who is the assignee on this patent?
- Inventec Pudong Tech Corp, Inventec Corp
- What technology area does this patent fall under?
- Primary CPC classification H10W40/735. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 24 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).