Systems for thermal management and methods for the use thereof

Patent metadata

Field	Value
Publication number	US-10121725-B2
Application number	US-201715811185-A
Country	US
Kind code	B2
Filing date	Nov 13, 2017
Priority date	May 29, 2015
Publication date	Nov 6, 2018
Grant date	Nov 6, 2018

Abstract

In accordance with the present invention, there are provided heat dispersing articles, assemblies containing same, methods for the preparation thereof, and various uses therefor. In one aspect of the present invention, there are provided heat dispersing articles. In another aspect of the present invention, there are provided methods for producing the above-referenced articles. In yet another aspect of the present invention, there are provided assemblies containing the above-referenced articles. In still another aspect of the present invention, there are provided methods for making the above-referenced assemblies. In yet another aspect, there are provided methods to dissipate the heat generated by portable electronic devices.

First claim

That which is claimed is:

1. A heat-dispersing article comprising:
a first conductive/protective layer,
one or more porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM) so as to substantially cover the surface and voids of said porous thermally conductive, low-profile structure,
wherein said formulated PCM comprises said PCM containing 5-20% by weight of a gelling agent mixed with said PCM, and

a second conductive/protective layer,
wherein said one or more porous thermally conductive, low-profile structure(s) are sandwiched between said first and second conductive/protective layers, and
wherein said article has:
a latency of at least 100 J/cc, and
an effective thermal conductivity of at least 10 W/mK.

2. The article of claim 1 wherein said porous thermally conductive, low-profile structure comprises a copper mesh, a copper cloth, a copper foam, an aluminum mesh, an aluminum cloth, or an aluminum foam.

3. The article of claim 2 wherein the porous thermally conductive, low-profile structure is a wire mesh.

4. The article of claim 2 , wherein the thickness of the porous thermally conductive, low-profile structure falls in the range of about 50 μm up to about 1 mm.

5. The article of claim 2 wherein the thickness of the formulated PCM is 1-2 times the thickness of the porous thermally conductive, low-profile structure.

6. The article of claim 1 wherein said porous thermally conductive, low-profile structure has an area opening ratio in the range of about 40% up to about 70%, and a volumetric opening ratio in the range of about 60% up to about 95%.

7. The article of claim 1 wherein said formulated PCM is prepared by mixing 5%-20% by weight of a gelling agent with a phase change material selected from:
a paraffin (C n H 2n+2 ), wherein n falls in the range of about 20 up to 40, or
a fatty acid (CH 3 (CH 2 ) 2n COOH) with similar melting temperature range, or
mixtures of any two or more thereof.

8. The article of claim 7 wherein said formulated PCM is substantially uniformly gelled throughout the thickness of said porous thermally conductive, low-profile structure(s).

9. The article of claim 1 wherein said PCM is encapsulated.

10. The article of claim 9 wherein:
said porous thermally conductive, low-profile structure is impregnated with said formulated PCM, and then
said impregnated porous thermally conductive, low-profile structure is laminated with a heat conducting sheet through a pressure sensitive adhesive (PSA) layer, which prevents the PCM from leaking out.

11. The article of claim 10 wherein said heat conducting sheet is a copper foil, a copper mesh, a copper cloth, a copper foam, an aluminum foil, an aluminum mesh, an aluminum cloth, an aluminum foam, or a graphite sheet.

12. The article of claim 11 wherein said heat conducting sheet has a thickness in the range of 25 μm to 500 μm.

13. The article of claim 11 wherein said heat conducting sheet is a graphite sheet having a thickness in the range of 25 μm to 70 μm.

14. A heat-dispersing assembly comprising:
5 μm to 20 μm thickness of a first pressure sensitive adhesive layer,
a conductive base layer having a thickness in the range of about 17 μm to 500 μm;
25 μm to 150 μm of a porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),
5 μm to 10 μm thickness of a second pressure sensitive adhesive layer,
25 μm to 50 μm thickness of a thermal conductive/protective layer, and
5 μm to 10 μm thickness of an electrical insulation layer.

15. A heat-dispersing assembly comprising:
5 μm to 20 μm thickness of a first pressure sensitive adhesive layer,
a conductive base layer having a thickness in the range of about 17 μm to 500 μm;
25 μm to 150 μm of a first porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),
5 μm to 10 μm thickness of a second pressure sensitive adhesive layer,
25 μm to 150 μm of a second porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),
25 μm to 50 μm thickness of a thermal conductive/protective layer, and
5 μm to 10 μm thickness of an electrical insulation layer.

16. A heat-dispersing assembly comprising:
5 μm to 20 μm thickness of a first pressure sensitive adhesive layer,
a conductive base layer having a thickness in the range of about 17 μm to 500 μm;
25 μm to 150 μm of a first porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),
5 μm to 10 μm thickness of a second pressure sensitive adhesive layer,
25 μm to 150 μm of a second porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),
5 μm to 10 μm thickness of a third pressure sensitive adhesive layer,
25 μm to 150 μm of a third porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),
25 μm to 50 μm thickness of a thermal conductive/protective layer, and
5 μm to 10 μm thickness of an electrical insulation layer.

17. A method to prepare an article according to claim 1 , said method comprising impregnating a porous thermally conductive, low-profile structure with a sufficient quantity of a molten form of a formulated phase change material (PCM) so as to substantially wet the porous thermally conductive, low-profile structure.

18. The method of claim 17 wherein said formulated phase change material comprises said PCM containing 5-20% by weight of a gelling agent mixed with said PCM.

Assignees

• Henkel IP & Holding GmbH

Inventors

• Zhao Yuan
• Berhe Mulugeta
• Maslyk Daniel
• Allen Scott Timon

Classifications

• H10P14/68

  Organic materials, e.g. photoresists · CPC title

• H10W40/735

  by melting or evaporation of solids · CPC title

• H10W40/257

  having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

• H10W40/251

  Organics · CPC title

• H10W40/73

  for cooling by change of state · CPC title