Battery module, battery pack including battery module, and vehicle including battery pack
US-12555845-B2 · Feb 17, 2026 · US
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Lee Jonggu patents
Lee Jonggu is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Jonggu |
| Total patents | 20 |
| First publication | Jul 21, 2016 |
| Latest publication | Feb 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated circuit device and method of manufacturing the same
US-2025227995-A1 · Jul 10, 2025 · US
Substrate processing apparatus
US-2025216802-A1 · Jul 3, 2025 · US
Substrate processing apparatus
US-12298676-B2 · May 13, 2025 · US
Semiconductor devices including substrate structure
US-2025107190-A1 · Mar 27, 2025 · US
Integrated circuit device and method of manufacturing the same
US-2025054822-A1 · Feb 13, 2025 · US
Substrate processing apparatus
US-2024142886-A1 · May 2, 2024 · US
Substrate supporting apparatus
US-2024079264-A1 · Mar 7, 2024 · US
Battery module, battery pack including battery module, and vehicle including battery pack
US-2024021911-A1 · Jan 18, 2024 · US
Method of manufacturing a semiconductor package
US-11848301-B2 · Dec 19, 2023 · US
Recent patents
Latest publications not already listed above.
Method of manufacturing a semiconductor package
US-2023238351-A1 · Jul 27, 2023 · US
Wafer chuck table and wafer chuck system
US-2023207369-A1 · Jun 29, 2023 · US
Apparatus and method for controlling chucking force
US-2023191547-A1 · Jun 22, 2023 · US
Method and apparatus to performing uplink transmission based on configured grant confirmation in wireless communication system
US-2023199754-A1 · Jun 22, 2023 · US
Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same
US-11626381-B2 · Apr 11, 2023 · US
Semiconductor chip bonding apparatus including head having thermally conductive materials
US-11607741-B2 · Mar 21, 2023 · US
Bonding head, die bonding apparatus including the same and method of manufacturing semiconductor package using the same
US-2021098415-A1 · Apr 1, 2021 · US
Semiconductor chip bonding apparatus including head having thermally conductive materials
US-2021069811-A1 · Mar 11, 2021 · US
Node unit of distributed antenna system
US-10448323-B2 · Oct 15, 2019 · US
Node unit of distributed antenna system
US-2016212699-A1 · Jul 21, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 15 |
| Solid Inc | 2 |
| Hyundai Motor Co Ltd | 2 |
| Kia Corp | 2 |
| Lg Electronics Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 8 |
| H10W72/072 | 6 |
| H10W72/241 | 6 |
| H10W72/07178 | 6 |
| H10W90/724 | 6 |