Wafer chucking system
US-2026005061-A1 · Jan 1, 2026 · US
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Choi Sebin patents
Choi Sebin is listed as an inventor on 9 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Choi Sebin |
| Total patents | 9 |
| First publication | Mar 11, 2021 |
| Latest publication | Jan 1, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Gas mixer
US-2025128215-A1 · Apr 24, 2025 · US
Gas mixing device, substrate processing system including the same, and substrate processing method using the same
US-2024424457-A1 · Dec 26, 2024 · US
Method of manufacturing a semiconductor package
US-11848301-B2 · Dec 19, 2023 · US
Method of manufacturing a semiconductor package
US-2023238351-A1 · Jul 27, 2023 · US
Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the same
US-11626381-B2 · Apr 11, 2023 · US
Semiconductor chip bonding apparatus including head having thermally conductive materials
US-11607741-B2 · Mar 21, 2023 · US
Bonding head, die bonding apparatus including the same and method of manufacturing semiconductor package using the same
US-2021098415-A1 · Apr 1, 2021 · US
Semiconductor chip bonding apparatus including head having thermally conductive materials
US-2021069811-A1 · Mar 11, 2021 · US
Recent patents
Latest publications not already listed above.
No data yet.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 9 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0431 | 7 |
| H10W74/15 | 6 |
| H10W72/072 | 6 |
| H10W72/241 | 6 |
| H10W90/724 | 6 |