Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing

Patent metadata

Field	Value
Publication number	US-11577358-B2
Application number	US-202016932615-A
Country	US
Kind code	B2
Filing date	Jul 17, 2020
Priority date	Jun 30, 2020
Publication date	Feb 14, 2023
Grant date	Feb 14, 2023

Abstract

A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, and a pad cooling assembly. The pad cooling assembly has an arm extending over the platen, a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, and an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening.

First claim

What is claimed is:

1. A chemical mechanical polishing system, comprising:
a platen to support a polishing pad having a polishing surface; and
a pad cooling assembly including
an arm extending over the platen, wherein the arm comprises a support plate having an aperture therethrough,
a nozzle suspended by the arm and coupled to a source of coolant fluid, the nozzle positioned to spray coolant fluid from the source onto the polishing surface of the polishing pad, wherein the nozzle is oriented to spray coolant fluid through the aperture, and
an opening in the arm adjacent the nozzle and a passage extending in the arm from the opening, the opening positioned sufficiently close to the nozzle that a flow of coolant fluid from the nozzle entrains air from the opening, wherein the opening is provided by a gap between an inner surface of the aperture and the nozzle.

2. The system of claim 1 , wherein a bottom of the nozzle is positioned above the support plate.

3. The system of claim 1 , wherein a portion of the nozzle extends into the aperture.

4. The system of claim 1 , wherein a top of the support plate is uncovered.

5. The system of claim 1 , wherein the arm comprises a housing covering the support plate and the nozzle.

6. The system of claim 5 , comprising a passage through the housing to connect an interior of the housing to external atmosphere.

7. The system of claim 5 , wherein a plurality of nozzles are nozzle suspended by the arm, and plurality of nozzles are in a common chamber of the housing.

8. The system of claim 1 , comprising a passage extending laterally through the support plate from at least one side wall of the aperture, wherein the opening is provided by the passage.

9. The system of claim 1 , comprising a plurality of passages extending laterally from a plurality of different side walls of the aperture through the support plate, wherein the opening is provided by the plurality of passages.

10. The system of claim 1 , comprising the source and the coolant fluid, and wherein the coolant fluid is a liquid.

11. The system of claim 10 , wherein the liquid is water, ethanol, and/or isopropyl alcohol.

12. The system of claim 10 , wherein gas is air, nitrogen, carbon dioxide, argon, evaporated ethanol and/or evaporated isopropyl alcohol.

13. The system of claim 1 , comprising the coolant source and the coolant fluid, and wherein the coolant fluid is a gas.

14. The system of claim 1 , wherein the nozzle comprises a convergent-divergent nozzle.

15. The system of claim 1 , comprising a controller configured to be coupled to the source and to cause the source to deliver the coolant fluid to the nozzle at a rate of 50-100 standard liters per minute.

16. A method of temperature control for a chemical mechanical polishing system, comprising:
supporting a nozzle on a support arm;
forming a coolant fluid by chilling air, by evaporating liquid nitrogen, by evaporating liquid ethanol, by evaporating of liquid isopropyl alcohol, and/or by sublimating dry ice, wherein the coolant fluid is a gas;
delivering the coolant fluid from a coolant source through the nozzle; and
entraining air from an opening in the support arm in a flow of coolant fluid from the nozzle so that a mixture of coolant fluid and entrained air is directed onto a polishing pad.

17. The method of claim 16 , wherein flowing the coolant fluid through the nozzle reduces a temperature of the coolant fluid.

18. The method of claim 16 , wherein the coolant fluid is a liquid.

19. The method of claim 18 , wherein the coolant fluid comprises liquid nitrogen, liquid water, liquid ethanol, and/or liquid isopropyl alcohol.

20. The method of claim 16 , comprising dispensing the mixture of coolant fluid and entrained air onto the polishing pad at a temperature below 0° C.

21. The method of claim 20 , comprising dispensing the mixture of coolant fluid and entrained air onto the polishing pad at a temperature between −70 to −50° C.

Assignees

• Applied Materials Inc

Inventors

• Kumar Surajit
• Chen Hui
• Chou Chih Chung
• Chang Shou-Sung

Classifications

• H10P72/00

  Handling or holding of wafers, substrates or devices during manufacture or treatment thereof · CPC title

• B24B53/095

  Cooling or lubricating during dressing operation (cooling the grinding surfaces B24B55/02) · CPC title

• B24B57/02

  for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents · CPC title

• B24B49/14

  taking regard of the temperature during grinding · CPC title

• B24B55/03

  designed as a complete equipment for feeding or clarifying coolant · CPC title