Methods and apparatus to control a fluid dispenser on a metallurgical specimen preparation machine
US-2019389032-A1 · Dec 26, 2019 · US
taking regard of the temperature during grinding
taking regard of the temperature during grinding · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B49/14 |
| Official title | taking regard of the temperature during grinding |
| Display label | taking regard of the temperature during grinding |
| Total patents | 223 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 12 |
| 2016 | 7 |
| 2017 | 20 |
| 2018 | 18 |
| 2019 | 14 |
| 2020 | 25 |
| 2021 | 21 |
| 2022 | 12 |
| 2023 | 35 |
| 2024 | 30 |
| 2025 | 23 |
| 2026 | 6 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Polishing device
US-2019193246-A1 · Jun 27, 2019 · US
Polishing method and polishing apparatus
US-2019118334-A1 · Apr 25, 2019 · US
Wafer polishing method and apparatus
US-2018369985-A1 · Dec 27, 2018 · US
Polishing method
US-2018369984-A1 · Dec 27, 2018 · US
Chemical mechanical polishing method
US-10160090-B2 · Dec 25, 2018 · US
Monitoring device, monitoring method, and device for cutting and grinding display substrate
US-10139802-B2 · Nov 27, 2018 · US
Methods and systems for polishing pad control
US-2018304437-A1 · Oct 25, 2018 · US
Methods and systems for polishing pad control
US-2018304436-A1 · Oct 25, 2018 · US
Polishing apparatus including pad contact member with baffle in liquid flow path therein
US-10099340-B2 · Oct 16, 2018 · US
Polishing apparatus and polishing method
US-2018290263-A1 · Oct 11, 2018 · US
Chemical mechanical polishing (CMP) platform for local profile control
US-10065288-B2 · Sep 4, 2018 · US
In-situ temperature control during chemical mechanical polishing with a condensed gas
US-10058975-B2 · Aug 28, 2018 · US
Heat exchanger for regulating surface temperature of a polishing pad, polishing apparatus, polishing method, and medium storing computer program
US-2018236631-A1 · Aug 23, 2018 · US
Polishing method and polishing apparatus
US-2018229344-A1 · Aug 16, 2018 · US
Method and apparatus for polishing a substrate
US-2018222007-A1 · Aug 9, 2018 · US
Polishing method and polishing apparatus
US-10035238-B2 · Jul 31, 2018 · US
Method and apparatus for polishing a substrate
US-9969046-B2 · May 15, 2018 · US
Grinding apparatus
US-2018029187-A1 · Feb 1, 2018 · US
Polishing method and polishing apparatus
US-2018021917-A1 · Jan 25, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24B49/14?
- CPC B24B49/14 is the Cooperative Patent Classification code for “taking regard of the temperature during grinding.”
- How many patents are filed under CPC B24B49/14 (taking regard of the temperature during grinding)?
- Our database includes 223 publications tagged with this CPC code.
- Is patent activity under CPC B24B49/14 growing?
- Publication counts under this code: 30 in 2024 vs 23 in 2025 (latest complete years).