Polishing apparatus having temperature regulator for polishing pad

Patent metadata

Field	Value
Publication number	US-9475167-B2
Application number	US-201213397908-A
Country	US
Kind code	B2
Filing date	Feb 16, 2012
Priority date	Feb 25, 2011
Publication date	Oct 25, 2016
Grant date	Oct 25, 2016

Abstract

A substrate polishing apparatus includes: a polishing table supporting a polishing pad; a top ring configured to press the substrate against the polishing pad; and a pad temperature regulator configured to regulate a surface temperature of the polishing pad. The pad temperature regulator includes a pad contact element and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact element. The pad contact element has a space therein and a partition that divide the space into a first liquid passage and a second liquid passage that are connected in series. At least one baffle substantially perpendicular to a radial direction of the polishing table is provided in each of the first liquid passage and the second liquid passage.

First claim

What is claimed is:

1. An apparatus for polishing a substrate by bringing the substrate into sliding contact with a polishing pad, said apparatus comprising:
a polishing table configured to be rotatable about its axis and support the polishing pad;
a top ring configured to press the substrate against the polishing pad on said polishing table; and
a pad temperature regulator configured to regulate a surface temperature of the polishing pad and provided above said polishing table,
wherein said pad temperature regulator includes
a pad contact element brought into contact with a surface of the polishing pad, and
a liquid supply system configured to supply a temperature-controlled liquid to said pad contact element,
wherein said pad contact element has a space therein and a partition that divide the space into a first liquid passage and a second liquid passage,
wherein said first liquid passage and said second liquid passage are connected in series at a location above a central portion of said polishing table,
wherein said first liquid passage is in communication with a liquid inlet coupled to said liquid supply system,
wherein said second liquid passage is in communication with a liquid outlet coupled to said liquid supply system,
wherein said partition extends in a radial direction of said polishing table, and
wherein plural baffles, extending substantially perpendicular to said partition and in approximately a circumferential direction of said polishing table, are provided in each of said first liquid passage and said second liquid passage, said plural baffles being staggered alternately to form each of said first liquid passage and said second liquid passage into a zigzag passage that extends alternately in a rotating direction of the polishing table and in a direction against the rotating direction,
wherein said plural baffles comprise first baffles and second baffles, said first baffles being connected to said partition and being substantially perpendicular to said partition, said second baffles being connected to a side of said pad contact element, and
wherein said first baffles and said second baffles are staggered alternately along a radial direction of said polishing table.

2. The apparatus according to claim 1 , wherein said plural baffles are arranged in parallel to each other.

3. The apparatus according to claim 1 , wherein said zigzag passage is wider at a central side than at a peripheral-side of the polishing pad.

4. The apparatus according to claim 1 , wherein said liquid inlet and said liquid outlet are located above a peripheral portion of the polishing pad.

5. The apparatus according to claim 1 , wherein said pad contact element includes:
a plate member that is brought into contact with the polishing pad; and
a passage-forming member having said partition therein.

6. The apparatus according to claim 5 , wherein said passage-forming member defining said first liquid passage and said second liquid passage has an inner surface covered with a heat insulator.

7. The apparatus according to claim 1 , wherein said pad contact element includes:
a passage-forming member having said partition and a contact surface brought into contact with the polishing pad; and
a plate member covering said passage-forming member.

8. The apparatus according to claim 1 , wherein said pad temperature regulator further includes:
an elevating mechanism configured to raise and lower said pad contact element; and
a moving mechanism configured to move said pad contact element between a predetermined raised position located above the polishing pad and a predetermined idling position located radially outwardly of said polishing table.

9. The apparatus according to claim 1 , wherein said pad temperature regulator further includes:
a cleaning mechanism configured to clean said pad contact element.

10. An apparatus for polishing a substrate by bringing the substrate into sliding contact with a polishing pad, said apparatus comprising:
a polishing table configured to support the polishing pad;
a top ring configured to press the substrate against the polishing pad on said polishing table; and
a pad temperature regulator configured to regulate a surface temperature of the polishing pad, said pad temperature regulator being disposed above said polishing table,
wherein said pad temperature regulator includes:
a pad contact element brought into contact with a surface of the polishing pad,
a liquid supply system configured to supply a temperature-controlled liquid to said pad contact element,
a header tube extending along a side surface of said pad contact element, said header tube being connected to a cleaning liquid supply source,
at least one cleaning-liquid spray nozzle provided on said header tube and communicating with said header tube, said at least one cleaning-liquid spray nozzle having a liquid outlet facing the side surface of said pad contact element,

wherein said pad contact element has a space therein and a partition that divides the space into a first liquid passage and a second liquid passage,
wherein said first liquid passage and said second liquid passage are connected in series,
wherein said first liquid passage is in communication with a liquid inlet coupled to said liquid supply system,
wherein said second liquid passage is in communication with a liquid outlet coupled to said liquid supply system,
wherein said partition extends in a radial direction of said polishing table, and
wherein at least one baffle, extending substantially perpendicular to the radial direction of said polishing table, is provided in each of said first liquid passage and said second liquid passage.

11. The apparatus according to claim 10 , wherein said at least one cleaning-liquid spray nozzle comprises a plurality of cleaning-liquid spray nozzles arranged along the side surface of said pad contact element.

Assignees

• Maruyama Toru
• Sone Tadakazu
• Motoshima Yasuyuki
• Ebara Corp

Inventors

• Maruyama Toru
• Sone Tadakazu
• Motoshima Yasuyuki

Classifications

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B37/04 Primary

  designed for working plane surfaces · CPC title

• B24B37/015

  Temperature control · CPC title