Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
US-12528151-B2 · Jan 20, 2026 · US
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Cooling or lubricating during dressing operation (cooling the grinding surfaces B24B55/02)
Cooling or lubricating during dressing operation (cooling the grinding surfaces B24B55/02) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B53/095 |
| Official title | Cooling or lubricating during dressing operation (cooling the grinding surfaces B24B55/02) |
| Display label | Cooling or lubricating during dressing operation (cooling the grinding surfaces B24B55/02) |
| Total patents | 22 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly growing.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2017 | 3 |
| 2018 | 1 |
| 2019 | 1 |
| 2020 | 2 |
| 2021 | 3 |
| 2023 | 3 |
| 2024 | 1 |
| 2025 | 5 |
| 2026 | 1 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Method for dressing polishing pad, method for polishing silicon wafer, method for producing silicon wafer, and device for polishing silicon wafer
US-2025353141-A1 · Nov 20, 2025 · US
Chemical mechanical polishing device and method
US-2025312881-A1 · Oct 9, 2025 · US
Disc Grinding for Semiconductor Wafers on Polishing System
US-2025282021-A1 · Sep 11, 2025 · US
Substrate lapping apparatus and substrate lapping method using the same
US-2025235980-A1 · Jul 24, 2025 · US
Non-contact pad cleaning apparatus
US-2025205850-A1 · Jun 26, 2025 · US
Apparatuses and methods for finishing the edges of glass sheets
US-2024424631-A1 · Dec 26, 2024 · US
Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
US-2023182259-A1 · Jun 15, 2023 · US
Method for refreshing polishing pad, method for manufacturing semiconductor device using the same and apparatus for manufacturing semiconductor device
US-2023091382-A1 · Mar 23, 2023 · US
Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
US-11577358-B2 · Feb 14, 2023 · US
Gas entrainment during jetting of fluid for temperature control in chemical mechanical polishing
US-2021402552-A1 · Dec 30, 2021 · US
Dressing apparatus and dressing method for substrate rear surface polishing member
US-2021308828-A1 · Oct 7, 2021 · US
Dressing apparatus and dressing method for substrate rear surface polishing member
US-11059145-B2 · Jul 13, 2021 · US
Apparatus for machining a workpiece with a tool having a fluid feed apparatus, and a method for setting up such an apparatus
US-10639760-B2 · May 5, 2020 · US
Burnishing tool and method of manufacturing the same
US-10603764-B2 · Mar 31, 2020 · US
Dressing apparatus and dressing method for substrate rear surface polishing member
US-2019047118-A1 · Feb 14, 2019 · US
Burnishing tool and method of manufacturing the same
US-2018339398-A1 · Nov 29, 2018 · US
Apparatus for machining a workpiece with a tool having a fluid feed apparatus, and a method for setting up such an apparatus
US-2017355055-A1 · Dec 14, 2017 · US
Method to shape the surface of chemical mechanical polishing pads
US-9802293-B1 · Oct 31, 2017 · US
Method and apparatus for conditioning polishing pad
US-9731401-B2 · Aug 15, 2017 · US