Polishing method and polishing apparatus

Patent metadata

Field	Value
Publication number	US-9782870-B2
Application number	US-201414465792-A
Country	US
Kind code	B2
Filing date	Aug 21, 2014
Priority date	Aug 27, 2013
Publication date	Oct 10, 2017
Grant date	Oct 10, 2017

Abstract

A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

First claim

What is claimed is:

1. A polishing apparatus for polishing a substrate by pressing the substrate against a polishing pad on a polishing table, comprising:
a top ring configured to press the substrate against the polishing pad on the polishing table; and
a pad temperature adjustment mechanism configured to adjust a surface temperature of the polishing pad radially extending annular areas,
wherein the pad temperature adjustment mechanism comprises a plurality of pad contact members configured to be brought in contact with the surface of the polishing pad to heat or cool the polishing pad, and arranged linearly from a central part to an outer circumferential part of the polishing pad in a radial direction of the surface of the polishing pad and configured to adjust the temperature in the radial direction of the polishing pad for each corresponding annular area of the polishing pad; and
a controller configured to individually control each of the plurality of pad contact members to adjust the temperature in the radial direction of the polishing pad for each corresponding annular area of the polishing pad wherein heated water or cold water can be supplied to each of the plurality of pad contact members at a controlled flow rate, further comprising:
a liquid supply system comprising a liquid supply tank having a heater therein, a heated water supply line having a first valve configured to supply heated water from the liquid supply tank to the pad contact member, a return line having a second valve configured to return the heated water from the pad contact member to the liquid supply tank, a cold water supply line having a third valve configured to supply cold water to the pad contact member, and a discharge line having a fourth valve configured to discharge the heated water or the cold water from the pad contact member to the outside of the liquid supply system,
wherein when the liquid to be supplied to at least one of the pad contact members is switched between the heated water and the cold water, the valve switching is performed with an appropriate delay so that the cold water is supplied to the at least one of the pad contact members after returning the heated water, remaining in the at least one of the pad contact members and piping, to the liquid supply system or the heated water is supplied to the at least one of the pad contact members after discharging the cold water remaining in the at least one of the pad contact members and piping.

2. The polishing apparatus according to claim 1 ,
wherein a partition is provided in an interior of each of the plurality of pad contact members to form a plurality of passages which have an inlet and an outlet, respectively and are configured to allow heated water or cold water to flow individually.

3. The polishing apparatus according to claim 1 , further comprising:
a plurality of thermometers arranged above the polishing pad in a radial direction of the surface of the polishing pad to measure the temperature in the radial direction of the polishing pad for each of the corresponding annular areas of the polishing pad which have been brought in contact with the plurality of pad contact members.

4. The polishing apparatus according to claim 3 ,
the controller configured to control the plurality of pad contact members to adjust the temperature in the radial direction of the polishing pad for each of the corresponding annular area of the polishing pad based on the measured temperatures by the plurality of thermometers.

Assignees

• Ebara Corp

Inventors

• Maruyama Toru
• Matsuo Hisanori
• Motoshima Yasuyuki

Classifications

• B24B37/015 Primary

  Temperature control · CPC title

• B24B49/14

  taking regard of the temperature during grinding · CPC title

• G01J2005/0085

  Physics · mapped topic

• G01J5/025

  Interfacing a pyrometer to an external device or network; User interface · CPC title

• G01J5/485

  Temperature profile · CPC title