Mechanisms for removing debris from polishing pad

Patent metadata

Field	Value
Publication number	US-9630295-B2
Application number	US-201313944353-A
Country	US
Kind code	B2
Filing date	Jul 17, 2013
Priority date	Jul 17, 2013
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

Embodiments of mechanisms for performing a chemical mechanical polishing (CMP) process are provided. A method for performing a CMP process includes polishing a wafer by using a polishing pad. The method also includes applying a cleaning liquid jet on the polishing pad to condition the polishing pad. A CMP system is also provided.

First claim

What is claimed is:

1. A method for performing a chemical mechanical polishing (CMP) process, comprising:
polishing a wafer by using a polishing pad;
applying a cleaning liquid jet on the polishing pad to condition the polishing pad during the polishing of the wafer; and
applying a second cleaning liquid jet on the polishing pad,
wherein a first acute angle between a main direction of the cleaning liquid jet and a surface of the polishing pad is different from a second acute angle between a main direction of the second cleaning liquid jet and the surface of the polishing pad, and the cleaning liquid jet is closer to a center of the polishing pad than the second cleaning liquid jet, and the first acute angle is smaller than the second acute angle.

2. The method for performing a CMP process as claimed in claim 1 , further comprising increasing a temperature of the cleaning liquid jet, wherein the temperature of the cleaning liquid jet is increased to be in a range from about 30° C. to about 99° C.

3. The method for performing a CMP process as claimed in claim 2 , further comprising controlling the temperature of the cleaning liquid jet by a temperature control assembly.

4. The method for performing a CMP process as claimed in claim 1 , wherein the cleaning liquid jet is pressurized to have a pressure in a range from about 100 hPa to about 300 hPa.

5. The method for performing a CMP process as claimed in claim 1 , wherein the cleaning liquid jet is applied on the polishing pad by using a jet provider.

6. The method for performing a CMP process as claimed in claim 5 , further comprising introducing a gas into the jet provider to pressurize the cleaning liquid jet.

7. The method for performing a CMP process as claimed in claim 6 , wherein the gas is made of N 2 , He, Ne, Ar, air, or combinations thereof.

8. The method for performing a CMP process as claimed in claim 1 , further comprising applying a third cleaning liquid jet on the polishing pad after the wafer is polished by using the polishing pad.

9. The method for performing a CMP process as claimed in claim 1 , further comprising:
removing the wafer from the polishing pad;
applying a third cleaning liquid jet on the polishing pad; and
transferring a second wafer on the polishing pad and polishing the second wafer after the third cleaning liquid jet is applied on the polishing pad.

10. The method for performing a CMP process as claimed in claim 1 , wherein the cleaning liquid jet is made of water.

11. The method for performing a CMP process as claimed in claim 1 , wherein the cleaning liquid jet contains no slurry particle.

12. The method for performing a CMP process as claimed in claim 1 , further comprising rotating the polishing pad during the application of the cleaning liquid jet on the polishing pad.

13. The method for performing a CMP process as claimed in claim 1 , further comprising conditioning the polishing pad by using a conditioning disk, wherein the cleaning liquid jet is applied on the polishing pad during the conditioning of the polishing pad by the conditioning disc.

14. The method for performing a CMP process as claimed in claim 13 , further comprising providing slurry on the polishing pad during the polishing of the wafer, wherein the slurry is provided using a slurry supply, the cleaning liquid jet is applied using a jet assembly, and the slurry supply, the wafer, the conditioning disk, and the jet assembly are sequentially arranged along a spinning direction of the polishing pad.

15. The method for performing a CMP process as claimed in claim 1 , wherein the cleaning jet and the second cleaning jet is provided by a jet provider.

16. The method for performing a CMP process as claimed in claim 1 , wherein the cleaning jet and the second cleaning jet contains no slurry particle.

17. The method for performing a CMP process as claimed in claim 1 , wherein the second cleaning jet is applied on the polishing pad during the polishing of the wafer.

18. A method for performing a chemical mechanical polishing (CMP) process, comprising:
polishing a wafer by using a polishing pad;
providing slurry on the polishing pad during the polishing of the wafer;
applying a cleaning liquid jet on the polishing pad to condition the polishing pad during the polishing of the wafer; and
applying a second cleaning liquid jet on the polishing pad,
wherein a first acute angle between a main direction of the cleaning liquid jet and a surface of the polishing pad is different from a second acute angle between a main direction of the second cleaning liquid jet and the surface of the polishing pad, and the cleaning liquid jet is closer to a center of the polishing pad than the second cleaning liquid jet, and the first acute angle is smaller than the second acute angle.

19. The method for performing a CMP process as claimed in claim 18 , further comprising increasing a temperature of the cleaning liquid jet during the application of the cleaning liquid on the polishing pad.

20. A method for performing a chemical mechanical polishing (CMP) process, comprising:
polishing a wafer by using a polishing pad;
applying a cleaning liquid jet on the polishing pad by using a jet provider to condition the polishing pad during the polishing of the wafer, wherein the cleaning liquid jet contains no slurry particle, and a gas is introduced into the jet provider to pressurize the cleaning liquid jet; and
applying a second cleaning liquid jet on the polishing pad,
wherein a first acute angle between a main direction of the cleaning liquid jet and a surface of the polishing pad is different from a second acute angle between a main direction of the second cleaning liquid jet and the surface of the polishing pad, and the cleaning liquid jet is closer to a center of the polishing pad than the second cleaning liquid jet, and the first acute angle is smaller than the second acute angle.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Peng He-Hui
• Huang Fu-Ming
• Suen Shich-Chang
• Kuo Han-Hsin
• Tsai Chi-Ming
• Chen Liang-Guang

Classifications

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B08B3/02

  Cleaning by the force of jets or sprays · CPC title

• B24B53/017 Primary

  Devices or means for dressing, cleaning or otherwise conditioning lapping tools · CPC title

• H01L21/304

  Electricity · mapped topic