Device and method for bonding of two substrates

Patent metadata

Field	Value
Publication number	US-11562912-B2
Application number	US-202217575101-A
Country	US
Kind code	B2
Filing date	Jan 13, 2022
Priority date	Sep 29, 2016
Publication date	Jan 24, 2023
Grant date	Jan 24, 2023

Abstract

A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.

First claim

What is claimed is:

1. A device for bonding a first substrate surface of a first substrate to a second substrate surface of a second substrate, said device comprising:
a first substrate holder for accommodating the first substrate, and
a second substrate holder for accommodating the second substrate,

wherein the first substrate holder has
a first recess with a fixing device for fixing the first substrate in the first recess,
a first elevation at least partly surrounding the first recess; and
at least one hole communicating with the first recess for evacuating and/or flushing an interior space of the device before and/or during and/or after bonding of the first substrate and the second substrate, wherein the at least one hole is useable to build up an overpressure in the interior space, the overpressure generated by a gas and/or a gas mixture, which is directed via the at least one hole.

2. The device according to claim 1 , wherein the gas and/or the gas mixture is a gas and/or a gas mixture with a negative Joule-Thompson coefficient (JTC).

3. The device according to claim 2 , wherein the gas and/or the gas mixture with the negative JTC includes helium, hydrogen, or neon.

4. The device according to claim 1 , wherein the overpressure is a pressure that is greater than 1 bar.

5. The device according to claim 1 , wherein the at least one hole is for evacuating and/or flushing the first recess, wherein the at least one hole is arranged in a symmetrically distributed manner.

6. The device according to claim 1 , wherein the first elevation is formed annularly around the first recess.

7. The device according to claim 1 , wherein the first elevation has a first expansion surface for expansion of the first substrate surface.

8. The device according to claim 7 , wherein the first recess and/or the first elevation is/are adapted to the first substrate in such a manner that the first substrate surface with the first expansion surface forms a substantially continuous surface and/or merges into the first elevation.

9. The device according to claim 7 , wherein the first recess and/or the first elevation is adaptable manually and/or semi-automatically and/or automatically such that the first substrate surface forms a substantially continuous surface with the first expansion surface and/or merges into the first elevation.

10. The device according to claim 7 , wherein a vertical distance between the first substrate surface and the first expansion surface is adjustable.

11. The device according to claim 1 , wherein the first substrate holder has an outer component and an inner component movable in the outer component, wherein the outer and/or the inner component is translationally and/or rotatably movable, and the outer and inner components are fixable to one another.

12. The device according to claim 11 , wherein the at least one hole is arranged in a symmetrically distributed manner in the inner component.

13. The device according to claim 1 , wherein the second substrate holder has a second recess with a fixing device for fixing the second substrate in the second recess, and a second elevation at least partly surrounding the second recess.

14. The device according to claim 13 , wherein the second elevation has a second expansion surface for expansion of the second substrate surface.

15. The device according to claim 14 , wherein a vertical distance between the second substrate surface and the second expansion surface is adjustable.

16. The device according to claim 1 , wherein the first elevation has an inwardly and/or outwardly curved expansion surface.

17. The device according to claim 1 , wherein the first elevation has an inwardly and/or outwardly bevelled extension surface at an angle (a).

18. The method for bonding a first substrate surface of a first substrate to a second substrate surface of a second substrate by means of a device according to claim 1 , wherein a gas arranged between the first and second substrate surfaces during the bonding process is displaced from a centre to an edge of the first and second substrates, wherein
an interior space of the device is evacuated and/or flushed through the at least one hole before and/or during and/or after the bonding of the first substrate and the second substrate; and
wherein an overpressure is built up in the interior space by directing a gas and/or a gas mixture from the at least one hole.

Assignees

• Ev Group E Thallner Gmbh

Inventors

• Wimplinger Markus
• Kurz Florian
• Dragoi Viorel

Classifications

• H10P90/1914

  using bonding · CPC title

• H10P72/7611

  characterised by edge profile or support profile · CPC title

• H10P10/128

  by direct semiconductor to semiconductor bonding · CPC title

• H10P72/0428 Primary

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• H01L21/67092 Primary

  Electricity · mapped topic