Device and method for measuring a substrate
US-2026036511-A1 · Feb 5, 2026 · US
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Wimplinger Markus patents
Wimplinger Markus is listed as an inventor on 114 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wimplinger Markus |
| Total patents | 114 |
| First publication | Jan 6, 2015 |
| Latest publication | Feb 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method and device for bonding of chips
US-2026026410-A1 · Jan 22, 2026 · US
Method of bonding a first substrate to a second substrate, bonding apparatus and assembly of first and second substrates
US-2026005189-A1 · Jan 1, 2026 · US
Device and method for measuring a substrate
US-12467850-B2 · Nov 11, 2025 · US
Method for bonding of chips
US-12456720-B2 · Oct 28, 2025 · US
Method and substrate system for the separation of carrier substrates
US-2025153481-A1 · May 15, 2025 · US
Method and device for compensating for distortions
US-2025125152-A1 · Apr 17, 2025 · US
Method for permanent connection of two metal surfaces
US-2024421109-A1 · Dec 19, 2024 · US
Method and device for producing and preparing electronic components
US-2024387270-A1 · Nov 21, 2024 · US
Stamp and method for embossing
US-12135500-B2 · Nov 5, 2024 · US
Recent patents
Latest publications not already listed above.
Method for permanent connection of two metal surfaces
US-12107057-B2 · Oct 1, 2024 · US
Method and device for bonding of chips
US-2024170474-A1 · May 23, 2024 · US
Device for bonding chips
US-11990463-B2 · May 21, 2024 · US
Device and method for bonding of two substrates
US-11862487-B2 · Jan 2, 2024 · US
Method and device for surface treatment of substrates
US-11776842-B2 · Oct 3, 2023 · US
Device and method for bonding substrates
US-2023294390-A1 · Sep 21, 2023 · US
Method and device for bonding of chips
US-11764198-B2 · Sep 19, 2023 · US
Accommodating device for retaining wafers
US-11756818-B2 · Sep 12, 2023 · US
Device and method for bonding substrates
US-11697281-B2 · Jul 11, 2023 · US
Device and method for injection molding
US-2023150180-A1 · May 18, 2023 · US
Device and method for bonding of two substrates
US-2023117625-A1 · Apr 20, 2023 · US
Device and method for bonding of two substrates
US-11562912-B2 · Jan 24, 2023 · US
Device and method for measuring a substrate
US-2022390356-A1 · Dec 8, 2022 · US
Accommodating device for retaining wafers
US-2022262663-A1 · Aug 18, 2022 · US
Method and device for surface treatment of substrates
US-2022216098-A1 · Jul 7, 2022 · US
Accommodating device for retaining wafers
US-11355374-B2 · Jun 7, 2022 · US
Method and device for surface treatment of substrates
US-11348825-B2 · May 31, 2022 · US
Method for permanent connection of two metal surfaces
US-2022165690-A1 · May 26, 2022 · US
Device and method for bonding of two substrates
US-2022139735-A1 · May 5, 2022 · US
Method for permanent connection of two metal surfaces
US-11282801-B2 · Mar 22, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ev Group E Thallner Gmbh | 112 |
| Wimplinger Markus | 23 |
| Hingerl Kurt | 6 |
| Plach Thomas | 5 |
| Flötgen Christoph | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P90/1914 | 49 |
| H10P72/0428 | 45 |
| H10P10/128 | 40 |
| H10W72/0198 | 37 |
| H01L21/187 | 32 |