Substrate processing system

Patent metadata

Field	Value
Publication number	US-11530483-B2
Application number	US-201916445096-A
Country	US
Kind code	B2
Filing date	Jun 18, 2019
Priority date	Jun 21, 2018
Publication date	Dec 20, 2022
Grant date	Dec 20, 2022

Abstract

Provided is a substrate processing system for improving productivity of processes. In this regard, the substrate processing system includes: a first chamber providing a space where at least one substrate is accommodated; a second chamber configured to transfer at least one substrate to the first chamber; and a temperature control unit configured to change a temperature of a gas in the second chamber.

First claim

What is claimed is:

1. A substrate processing system comprising:
a reaction chamber providing a space where at least one substrate is processed;
a substrate transfer chamber configured to supply the at least one substrate to the reaction chamber;
a gas supply line connected to the substrate transfer chamber; and
at least one heater configured to heat a gas supplied to the substrate transfer chamber,
wherein, when the reaction chamber and the substrate transfer chamber communicate with each other, a pressure of the gas of the substrate transfer chamber is equal to or higher than a pressure of a gas of the reaction chamber,
wherein the at least one heater comprises:
a first heater arranged at the gas supply line; and
a second heater arranged at the substrate transfer chamber.

2. The substrate processing system of claim 1 , wherein the at least one heater is arranged at the substrate transfer chamber, and accordingly, the gas inside the substrate transfer chamber is heated.

3. The substrate processing system of claim 1 , further comprising a protective cover configured to block heat radiated from the at least one heater.

4. The substrate processing system of claim 3 , wherein the protective cover is arranged between the substrate transfer chamber and the reaction chamber.

5. The substrate processing system of claim 1 , wherein the at least one heater is arranged at the gas supply line, and accordingly, the gas passing through the gas supply line is heated.

6. The substrate processing system of claim 1 , wherein the first heater and the second heater are independently heated.

7. The substrate processing system of claim 1 , wherein a first heating temperature of the first heater is equal to or higher than a second heating temperature of the second heater.

8. The substrate processing system of claim 1 , further comprising a substrate transfer unit arranged at the substrate transfer chamber,
wherein the substrate transfer unit comprises a cooling member.

9. The substrate processing system of claim 1 , wherein a temperature of the gas heated by the at least one heater is equal to or higher than an internal temperature of the reaction chamber.

10. The substrate processing system of claim 1 , wherein, when a substrate is introduced from the substrate transfer chamber to the reaction chamber, the temperature of the gas heated by the at least one heater is higher than the internal temperature of the reaction chamber.

11. The substrate processing system of claim 1 , wherein the at least one heater is further configured to heat the gas before a substrate is discharged from the reaction chamber.

12. The substrate processing system of claim 1 , wherein the at least one heater is further configured to heat the gas before a substrate is introduced to the reaction chamber.

13. The substrate processing system of claim 1 , wherein at least some of the gas heated by the at least one heater is introduced from the substrate transfer chamber to the reaction chamber.

14. A substrate processing system comprising:
a first chamber providing a space where at least one substrate is accommodated;
a second chamber configured to transfer the at least one substrate to the first chamber;
a gas supply line connected to the second chamber; and
a temperature control unit configured to change a temperature of a gas in the second chamber,
wherein the temperature control unit comprises:
a first heater arranged at the gas supply line; and
a second heater arranged at the second chamber.

15. The substrate processing system of claim 14 , wherein the gas having the temperature changed by the temperature control unit is introduced from the second chamber to the first chamber.

16. The substrate processing system of claim 14 , further comprising a third chamber providing a space where the at least one substrate is accommodated,
wherein the temperature control unit is further configured to, when the at least one substrate is moved from the first chamber to the third chamber, change the temperature of the gas in the second chamber to correspond to a temperature condition of the third chamber.

17. A substrate processing system comprising:
a load lock chamber configured to accommodate at least one substrate;
a reaction chamber providing a space where the at least one substrate is processed;
a substrate transfer chamber configured to transfer the at least one substrate between the load lock chamber and the reaction chamber;
a gas supplier configured to supply a gas to the substrate transfer chamber;
a gas supply line connecting the gas supplier and the substrate transfer chamber; and
at least one heater arranged at least one of the gas supplier, the substrate transfer chamber, and the gas supply line, and configured to heat the gas,
wherein, when the reaction chamber and the substrate transfer chamber communicate, at least some of the gas heated by the at least one heater is introduced from the substrate transfer chamber to the reaction chamber, and
the at least one heater is further configured to heat the gas before the at least one substrate is introduced to the reaction chamber and before the at least one substrate is discharged from the reaction chamber,
wherein the at least one heater comprises:
a first heater arranged at the gas supply line; and
a second heater arranged at the substrate transfer chamber.

18. The substrate processing system of claim 17 , further comprising a protective cover arranged between the substrate transfer chamber and the load lock chamber and configured to block heat radiated from the at least one heater.

Assignees

• Asm Ip Holding Bv

Inventors

• Min Yoonki
• Kim Younghoon
• Lee Hakjoo
• Chun SeungJu

Classifications

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/32

  between different workstations · CPC title

• C23C14/566

  using a load-lock chamber · CPC title

• H01J37/32522

  Temperature · CPC title

• H01J37/32743

  for introducing the material into processing chamber · CPC title