Solder material, solder paste, solder preform, solder joint and method of managing the solder material
US-10717157-B2 · Jul 21, 2020 · US
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Okada Hiroshi patents
Okada Hiroshi is listed as an inventor on 2 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Okada Hiroshi |
| Total patents | 2 |
| First publication | Nov 2, 2017 |
| Latest publication | Jul 21, 2020 |
Notable patents
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Recent patents
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Senju Metal Industry Co | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D3/60 | 2 |
| B23K35/025 | 2 |
| B23K35/262 | 2 |
| C22C13/00 | 2 |
| C22F1/08 | 2 |