Solder alloy, solder paste, and electronic circuit board
US-9221132-B2 · Dec 29, 2015 · US
with the principal constituent melting at less than 400°C
with the principal constituent melting at less than 400°C · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K35/26 |
| Official title | with the principal constituent melting at less than 400°C |
| Display label | with the principal constituent melting at less than 400°C |
| Total patents | 533 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 60 |
| 2016 | 53 |
| 2017 | 61 |
| 2018 | 54 |
| 2019 | 59 |
| 2020 | 42 |
| 2021 | 45 |
| 2022 | 33 |
| 2023 | 46 |
| 2024 | 35 |
| 2025 | 38 |
| 2026 | 7 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Solder alloy, solder paste, and electronic circuit board
US-9221129-B2 · Dec 29, 2015 · US
Light emitting device and method of producing the light emitting device
US-2015362158-A1 · Dec 17, 2015 · US
Bi—Al—Zn—based Pb-free solder alloy
US-9211614-B2 · Dec 15, 2015 · US
Bi—Sn based high-temperature solder alloy
US-9205513-B2 · Dec 8, 2015 · US
Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part
US-9209527-B2 · Dec 8, 2015 · US
Flux and solder paste
US-2015343571-A1 · Dec 3, 2015 · US
Solder material and bonded structure
US-9199340-B2 · Dec 1, 2015 · US
Bonded body and semiconductor module
US-9196563-B2 · Nov 24, 2015 · US
Lead-free solder alloy
US-2015328722-A1 · Nov 19, 2015 · US
Mechanical processing of reactive laminates
US-9186755-B2 · Nov 17, 2015 · US
Power module
US-2015319876-A1 · Nov 5, 2015 · US
Power module
US-2015319877-A1 · Nov 5, 2015 · US
Layered solder material for bonding dissimilar electrodes, and method for bonding dissimilar electrodes to electronic components
US-2015314396-A1 · Nov 5, 2015 · US
Solder paste and solder joint
US-9162324-B2 · Oct 20, 2015 · US
Method for bonding bare chip dies
US-2015294951-A1 · Oct 15, 2015 · US
Composition of a solder, and method of manufacturing a solder connection
US-2015290746-A1 · Oct 15, 2015 · US
Lead-free jointing material and method of producing the same
US-9157135-B2 · Oct 13, 2015 · US
Soldering method using a low-temperature solder paste
US-2015282332-A1 · Oct 1, 2015 · US
Solder alloy for die bonding
US-2015258637-A1 · Sep 17, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K35/26?
- CPC B23K35/26 is the Cooperative Patent Classification code for “with the principal constituent melting at less than 400°C.”
- How many patents are filed under CPC B23K35/26 (with the principal constituent melting at less than 400°C)?
- Our database includes 533 publications tagged with this CPC code.
- Is patent activity under CPC B23K35/26 growing?
- Publication counts under this code: 35 in 2024 vs 38 in 2025 (latest complete years).